PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
This code uses Proteus simulation, uses 51 single-chip microcomputer to simulate PWM, uses timer to obtain motor speed information, uses PID algorithm speed, speed, P, I, D can all be set with buttons...
Today I saw a power filter circuit like this. After the power is turned on, the normally open contact of the relay is closed and the filter capacitor (8UF) is substituted into the circuit through two ...
Technical characteristics of BluetoothBluetooth is a technical specification for short-range wireless communication. Its original goal was to replace the existing wired cable connections on various di...
The price of stm32 microcontroller has risen horribly, and there are scalpers who are disrupting the market.Now we urgently need domestic 32-bit arm m3 m4 m7 microcontrollers to replace stm32 MCUs; re...
How to easily determine the diameter of the adapter : https://training.eeworld.com.cn/course/4827Sometimes, a small problem at work may drive you crazy...For example, you find that you have an adapter...
According to news on March 14, TrendForce recently released a report stating that the mainstream specification in the HBM memory market in 2024 will be HBM3, but NVIDIA’s upcoming B100 or H200 accele...[Details]
Image source: Physicists' Organization website
A joint research team led by scientists from the School of Electrical Engineering at the Korea Advanced Institute of Science and Technolo...[Details]
On May 19, 2023, Renesas Electronics announced the company's 2030 vision at the 2023 Investor Day: by then, the company's total revenue will exceed 20 billion US dollars, and it hopes to become the t...[Details]
On April 25, according to Korean media Viva100, SK Hynix stated in a first-quarter earnings conference call held today that its 12-layer stacked (12Hi) HBM3E memory development is expected to be co...[Details]
According to news on November 22, at NVIDIA’s third quarter results meeting, NVIDIA’s chief financial officer said that it is currently studying solutions for export-restricted areas, and it is too e...[Details]
Samsung Electronics said it has opened a new R&D research laboratory in Silicon Valley, USA, to focus on the development of next-generation 3D DRAM chips. The laboratory, operated by Device Solution...[Details]
On July 5, the source Moore's Law Is Dead revealed that AMD will release Zen 6 architecture chips in the second quarter of 2025, using TSMC's N3E process. Mass production will start before the end ...[Details]
"After 2019, our pace of innovation began to accelerate, with new GPU products launched every year. We also developed CPU IP to meet different market needs," said Imagination CIO Tim Mamtora.
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On February 22, according to Kyodo News, the Japanese government decided to provide a financial subsidy of approximately 730 billion yen (currently approximately 34.967 billion yuan) to the second fa...[Details]
Summary The semiconductor industry chain and supply chain game is becoming the main battlefield in the competition between China and the United States. The strategic outline of the United Sta...[Details]
This new platform streamlines product development, saves time, and ensures operational efficiency for customers across industries Shanghai, China, March 15, 2024 - element14, a global distributor o...[Details]
News on August 29, according to the latest report from DigiTimes: TSMC is unlikely to see a significant increase in 3nm chip orders before 2024. According to sources, due to delays in Intel's shipmen...[Details]
According to a Reuters report on May 31, three sources said that a consortium's plan to spend $3 billion to build semiconductor facilities in India has stalled because of the Israeli chip manufacture...[Details]
According to media reports on December 21, at today’s “2023 Science and Technology Ranking” annual ceremony, Zheng Weimin, academician of the Chinese Academy of Engineering and professor of Tsinghua ...[Details]
According to Reuters on March 18, two people familiar with the matter revealed that TSMC is considering building advanced packaging production capacity in Japan, which would add impetus to Japan's re...[Details]
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