MMSZ5259CS datasheet, PDF - EEWORLD Datasheet

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MMSZ5259CS: DescriptionZener diode; CategoryDiscrete semiconductor; File Size5MB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

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MMSZ5259CS Overview

Zener diode

Features

Product Name: Zener Diode

Product model: MMSZ5259CS

product features:

Planar Die Construction

Ultra-Small Surface Mount Package

General purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Product parameters:

Pd power dissipation: 200mW

Vz stable voltage: Nom=39V Min=38.22V Max=39.78V

Zzt breakdown impedance: 80Ω

Zzk breakdown impedance: 800Ω

IR reverse current: 0.1uA

Vf forward voltage drop: 0.9V

Package: SOD-323

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JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOD-323 Plastic-Encapsulate Diodes

SOD-323

MMSZ5221CS-MMSZ5259CS

ZENER DIODE

FEATURES

Planar Die Construction

Ultra-Small Surface Mount Package

General purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Maximum Ratings

(Ta=25℃

unless otherwise specified)

Characteristic

Forward Voltage (Note 2)

Power Dissipation(Note 1)

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

@ I

= 10mA

Symbol

θJA

STG

Value

0.9

200

625

-65

+150

Unit

℃/W

℃

Notes: 1. Device mounted on ceramic PCBS; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm .

2. Tested with pulses, Tp≤1.0ms.

A,Dec,2011

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