KMB22F-KMB210F
Schottky Surface Mount Flat Bridge Rectifier
Features
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Low profile package
Ideal for automated placement
Ultrafast reverse recovery time
Low power losses, high efficiency
Low forward voltage drop
High surge capability
High temperature soldering：
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Date
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Case:
MBF molded plastic body over
Schottky barrier chips
Terminals:
Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity:
Polarity symbols marked on body
Maximum Ratings & Thermal Characteristics & Electrical Characteristics
(T
A
= 25 °C unless otherwise noted)
Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.2×0.2"(5.0×5.0mm)copper pad area
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
Maximum instantaneous forward voltage at 2.0A
Maximum DC reverse current
at Rated DC blocking voltage
T
A
= 25
℃
T
A
= 100℃
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
C
J
R
θJA
R
θJL
T
J
T
STG
KMB22F KMB24F KMB26F KMB28F KMB210F UNIT
20
14
20
40
28
40
60
42
60
2.0
50
0.50
0.55
0.70
0.5
20
250
85
20
–55 to +125
– 55 to +150
125
0.85
80
56
80
100
70
100
V
V
V
A
A
V
mA
pF
℃/
W
℃
℃
Typical Junction Capacitance at 4.0V,1.0MHz
Typical Thermal resistance (Note1)
Operating junction temperature range
Storage temperature range
Note：1.Thermal resistance from junction to ambient and from junction to lead P.C.B.mounted on 0.2×0.2"(5.0×5.0mm)copper pad areas.
PCB Design
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