K596-TO-92S datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > K596-TO-92S

Preview

K596-TO-92S: DescriptionSi N-CHANNEL JUNCTION FET; File Size585KB，3 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

K596-TO-92S Overview

Si N-CHANNEL JUNCTION FET

K596-TO-92S Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-92S Plastic-Encapsulate Transistors

ＴＯ－９２Ｓ　

1.SOURCE

K596

Si N-CHANNEL JUNCTION FET

FEATURES

Power dissipation

: 0.1W（Tamb=25℃）

Gate Current

: 10mA

Drain current

: 1mA

Drain-Source voltage

GDO

: -20

Operating and storage junction temperature range

，T

stg

: -55℃ to +150℃

ELECTRICAL CHARACTERISTICS（Tamb=25℃

Parameter

Gate-Drain breakdown Voltage

Gate-Source cut-off Voltage

Drain Current

Forward Transfer Admittance

Input Capacitance

Symbol

GDO

GS(off)

DSS

iss

2.GATE

3.DRAIN

　　　　　　　　　　　　　123

unless

Test

otherwise

specified）

MIN

-20

-0.6

100

0.4

1.2

3.5

-1.5

800

TYP

MAX

UNIT

　μA

　　½Ｓ

conditions

= -100μA

= 5V , I

=1μA

= 5 V , V

= 5V , V

=0, f=1KHz

=5V, V

=0, f=1MHz

= 5 V, V =0

Output Capacitance

RSS

0.65

f =

1MHz

DSS

Classification

DSS

(µA)

100-170

150-240

210-350

320-480

440-800

Recommended Resources

DC relay delayed release circuit one a

Forward/reverse circuit composed of power op amp

Proportional thermostat circuit

28MHz FM receiver high amplifier circuit

In-flight phone anti-theft device

Sawtooth wave, triangle wave, and digital wave oscillator

KiCad 5.1.5 latest stable version Chinese tutorial: Want to learn KiCad~ Very detailed tutorial...; ohahaha PCB Design

Understand C language pointers in 1 minute: All data in the computer must be placed in the memory. Different types of data occupy different numbers of bytes. For example, int occupies 4 bytes and char occupies 1 byte. In order to access this da...; Aguilera Microcontroller MCU

TMS320F28377S LaunchPad XDS100 V2 driver cannot be installed: It turned out that there was a problem with the driver in the device manager and it could not be downloaded. No matter how I installed it, it worked. Later, I deleted the related files of ftdi and xds...; littleshrimp DSP and ARM Processors

Building a Raspberry Pi Pico development environment under Windows: This is what I did before. I bought one myself, and then I applied for another one and won it. But now I have two different boards I applied for. I feel like I have to put this Pico board aside, so I ...; gao_hex Innovation Lab

On-policy, its process is the same as the above strategic gradient. Practical analysis: This article mainly summarizes the part about strategic iteration, focusing on explaining the principle. Li Hongyi’s video can be found online. Finally, let’s explain the part about PPO, OpenAI’s defa...; it先森 Wireless Connectivity

【ESP32-Korvo Review】 03 Blinker Lighting: [i=s]This post was last edited by Tianyiwuzui on 2021-3-8 21:36[/i]As soon as I got to work at the beginning of the year, I started working 996 , which is unbearable. I took advantage of the Sunday br...; 天意无罪 Domestic Chip Exchange

Popular Components