Founded in Silicon Valley in 2005, GigaDevice is a leading fabless semiconductor company dedicated to providing advanced storage technologies and IC solutions. The company successfully completed its IPO on the Shanghai Stock Exchange in 2016. GigaDevice offers a wide range of high-performance flash memory and 32-bit general-purpose MCU products. It is one of the pioneers of SPI NOR flash memory and currently ranks third in the world in this market segment, with more than 1 billion units shipped annually.
Since 2007, GigaDevice has filed more than 600 patent applications and obtained more than 200 patents. More than 55% of employees are engaged in research and development, which is the basis for continuously differentiating its products from competitors in the market. The GigaDevice management team has absorbed the leading semiconductor industry experience of well-known storage companies in Silicon Valley, South Korea and Taiwan. GigaDevice has passed ISO9001 and ISO14001 certifications from DQS.
GigaDevice currently produces SPI NOR Flash, SPI NAND Flash, and MCUs for embedded, consumer, and mobile communications applications. Its manufacturing model is based on strong relationships with foundry, assembly, and test subcontractor partners. GigaDevice believes that this clearly defined fabless manufacturing model offers a competitive advantage over traditional manufacturing-based integrated device manufacturers because capital equipment expenditures to maintain advanced memory process technologies exceed market returns in many IC memory market sectors. GigaDevice's foundry partners' continued investment in advanced equipment and their rapid growth in 12" wafer capacity are key factors in its success over competitors.
| Parameter Name | Attribute value |
| CPU core | ARM Cortex-M3 |
| CPU maximum frequency | 108MHz |
| Working voltage range | 2.6V~3.6V |
| Internal oscillator | have |
| External clock frequency range | 3MHz~32MHz |
| Program FLASH capacity | 512KB |
| total RAM capacity | 64KB |
| EEPROM/data FLASH capacity | - |
| Number of GPIO ports | 51 |
| ADC (number of units/number of channels/digits) | 3@x12bit |
| DAC (number of units/number of channels/digits) | 2@x12bit |
| (E)PWM (number of units/number of channels/digits) | 2@x16bit |
| 8-bit Timer quantity | - |
| Number of 16-bit Timers | 6 |
| Number of 32-bit Timers | - |
| Number of internal comparators | - |
| Number of U(S)ART channels | 5 |
| Number of I2C channels | 2 |
| Number of I2S channels | - |
| (Q) Number of SPI channels | 3 |
| Number of CAN channels | 1 |
| USB (master/slave/adaptive) | Full speed USB Device |
| Peripherals/functions/protocol stack | On-chip temperature sensor; DMA; watchdog; LIN bus protocol; PWM; IrDA; SDIO; RTC real-time clock |
| range of working temperature | -40℃~+85℃ |
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