FMMBD4448HADW datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > FMMBD4448HADW

Preview

FMMBD4448HADW: DescriptionSURFACE MOUNT SWITCHING DIODE ARRAYS; File Size211KB，4 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

FMMBD4448HADW Overview

SURFACE MOUNT SWITCHING DIODE ARRAYS

FMMBD4448HADW Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

WBFBP-06C Plastic-Encapsulate Diode

FMMBD4448HADW

SURFACE MOUNT SWITCHING DIODE ARRAYS

DESCRIPTION

Silicon epitaxial planar

Switching Diode

FEATURES

Ultra-Small Surface Mount Package

Fast Switching Speed

High Conductance

APPLICATION

For General Purpose Switching Applications, rectifiers

For portable equipment:(i.e. Mobile phone,MP3, MD,CD-ROM,

DVD-ROM, Note book PC, etc.)

WBFBP-06C

(2×2×0.5)

unit: mm

Maximum Ratings and Electrical Characteristics, Single Diode @T

=25

Parameter

Non-Repetitive Peak reverse voltage

Peak Repetitive peak reverse voltage

Working Peak Reverse Voltage

DC Blocking

Voltage

Symbol

RRM

RWM

R(RMS)

FSM

θJA

STG

500

250

4.0

2.0

150

625

150

100

FMMBD4448HADW

Marking:KA6

Unit

Limits

RMS Reverse Voltage

Forward Continuous Current

Average Rectified Output Current

Non-Repetitive Peak forward surge current @=1.0µs

@=1.0s

Power Dissipation

Thermal Resistance Junction to Ambient

Junction temperature

Storage temperature range

℃/W

℃

-65 to +150

Electrical Ratings @T

=25℃

Parameter

Reverse Breakdown Voltage

Symbol

Forward voltage

Reverse current

Capacitance between terminals

Reverse Recovery Time

Min.

0.62

0.72

0.855

1.0

1.25

0.1

3.5

Typ.

Max.

Unit

µA

Conditions

=100μA

=5mA

=10mA

=100mA

=150mA

=70V

=20V

=6V,f=1MHz

=6V,I

=5mA

Recommended Resources

Complementary symmetrical push-pull circuit

Capacitor input type rectifier circuit diagram

Thermocouple A/D conversion circuit

Fully automatic water supply control circuit

High power multivibrator circuit

1Hz clock oscillator with backup power

[Qinheng RISC-V core CH582] 7- Use CH582 Bluetooth notify to actively upload data: In the previous section, we used CH582 as a GATT server to implement read and write operations. Both operations are initiated by the client. The server can actively upload data using the notify method...; manhuami2007 Domestic Chip Exchange

[Repost] Popular Science of Components: Complete Component Selection Specifications: [align=left][color=rgb(25, 25, 25)][font="]Electronic components are the basic parts of electronic systems. They are the basic circuit units that can complete the predetermined functions and cannot be...; 皇华Ameya360 Power technology

FAQ_How to construct the IPv6 address of the node in ST 6LowPAN networking technology: Author: ST Engineer Click to download the pdf document:Keywords: IPv6, 6LoWPANQuestion: When using ST's 6LowPAN network technology based on the S2-LP small radio, how are the IPv6 addresses of the nod...; nmg ST - Low Power RF

TI official header file DSP2833x_Gpio.h content: The contents of TI's official header file DSP2833x_Gpio.h are as follows: // TI File $Revision: /main/4 $// Checkin $Date: November 15, 2007 09:58:53 $//###############################################...; fish001 DSP and ARM Processors

One of the PFC tubes works, but the other one always has problems. Can someone please tell me why?: A 2kw PFC uses a single tube IPW60R099P7 with a switching frequency of 120K. It is found that after disconnecting the AC (disconnecting the input AC under load), and then re-powering on, the tube beco...; qoistoochee128 Power technology

Press button to trigger battery charge display: Hey guys, I am going to use CN1185 to make a battery level display. I want to add a display circuit like a power bank where you press a button and the LED lights up. What else should I add?...; 朝朝暮暮朝朝 LED Zone

Popular Components