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ER1001ACT

Description
10 A, 150 V, SILICON, RECTIFIER DIODE, TO-220AB
CategoryDiscrete semiconductor    diode   
File Size38KB,2 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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ER1001ACT Overview

10 A, 150 V, SILICON, RECTIFIER DIODE, TO-220AB

ER1001ACT Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
Parts packaging codeTO-220AB
package instructionROHS COMPLIANT, PLASTIC PACKAGE-3
Contacts3
Reach Compliance Code_compli
Other featuresLOW POWER LOSS
applicationEFFICIENCY
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)0.95 V
JEDEC-95 codeTO-220AB
JESD-30 codeR-PSFM-T3
Maximum non-repetitive peak forward current150 A
Number of components2
Phase1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current10 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum repetitive peak reverse voltage150 V
Maximum reverse recovery time0.035 µs
surface mountNO
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED

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Download Datasheet
DATA SHEET
ER1000CT~ER1004CT
SUPERFAST RECOVERY RECTIFIERS
VOLTAGE
FEATURES
50 to 400 Volts
CURRENT
10 Amperes
TO-220AB
Unit : inch (mm)
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
• Exceeds environmental standards of MIL-S-19500/228
• Low power loss, high efficiency.
• Low forwrd voltge, high current capability
• High surge capacity.
• Super fast recovery times, high voltage.
• Pb free product are available :
99% Sn above can meet Rohs environment
substance directive request
.419(10.66)
.387(9.85)
.139(3.55)
MIN
.196(5.00)
.163(4.16)
.054(1.39)
.045(1.15)
.269(6.85)
.226(5.75)
.624(15.87)
.50(12.7)MIN
MECHANICALDATA
Case: TO-220AB Molded plastic
Terminals: Lead solderable per MIL-STD-202G, Method 208
Polarity: As marked.
Standard packaging: Any
Weight: 0.08 ounces, 2.24grams.
.038(0.96)
.019(0.50)
.177(4.5)MAX
.548(13.93)
.025(0.65)MAX
.1(2.54)
.1(2.54)
AC
Positive CT
AC
MAXIMUM RATING AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RA M E TE R
M a xi m um R e c ur r e nt P e a k R e ve r s e V o l t a g e
M a xi m um R M S V o l t a g e
M a xi m um D C B l o c k i ng V o l t a g e
M a xi m um A ve r a g e F o r w a r d C ur r e nt . 3 7 5 " ( 9 . 5 m m )
l e a d l e n g t h a t Tc = 1 0 0
O
C
P e a k F o r w a r d S ur g e C ur r e nt , 8 . 3 m s s i ng l e ha l f s i ne - w a ve
s up e r i m p o s e d o n r a t e d l o a d ( J E D E C m e t ho d )
M a xi m um F o r w a r d V o l t a g e a t 5 A , p e r e l e m e nt
M a x i m u m D C R e v e r s e C u r r e n t a t TA = 2 5
O
C
R a t e d D C B l o c k i n g V o l t a g e TA = 1 0 0
O
C
M a x i m u m R e v e r s e R e c o v e r y Ti m e ( N o t e 2 )
Ty p i c a l J u n c t i o n c a p a c i t a n c e ( N o t e 1 )
M a xi m um The r m a l R e s i s t a nc e
O p e r a t i n g J u n c t i o n a n d S t o r a g e Te m p e r a t u r e R a n g e
S YM B O L E R 1 0 0 0 C T E R 1 0 0 1 C T E R 1 0 0 1 A C T E R 1 0 0 2 C T E R 1 0 0 3 C T E R 1 0 0 4 C T
V
RRM
V
RMS
V
DC
I
AV
I
F S M
V
F
I
R
T
RR
C
J
Rθ J C
T
J
, T
S TG
35
62
3 .0
- 5 0 TO + 1 5 0
0 .9 5
10
500
50
50
35
50
100
70
100
150
105
150
1 0 .0
150
1 .3 0
200
140
200
300
210
300
400
280
400
U N IT S
V
V
V
A
A
V
uA
ns
pF
O
C / W
O
C
NOTES:
1. Measured at 1 MHz and applied reverse voltage of 4.0 VDC.
2. Reverse Recovery Test Conditions: I
F
=.5A, I
R
=1A, Irr=.25A.
3. Both Bonding and Chip structure are available.
STAD-NOV.24.2004
PAGE . 1
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