BZX84C56_R2_00001 datasheet, PDF

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BZX84C56_R2_00001: DescriptionZener Diode, 56V V(Z), 5%, 0.41W, Silicon, Unidirectional, GREEN, PLASTIC PACKAGE-3; CategoryDiscrete semiconductor diode; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZX84C56_R2_00001 Overview

Zener Diode, 56V V(Z), 5%, 0.41W, Silicon, Unidirectional, GREEN, PLASTIC PACKAGE-3

BZX84C56_R2_00001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	R-PDSO-G3
Reach Compliance Code	compliant
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	135 Ω
JESD-30 code	R-PDSO-G3
Number of components	1
Number of terminals	3
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.41 W
Nominal reference voltage	56 V
surface mount	YES
technology	ZENER
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	5%
Working test current	2.5 mA
Base Number Matches	1

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BZX84C2V4 SERIES

SURFACE MOUNT SILICON ZENER DIODES

VOLTAGE

2.4 to 75 V

olt

POWER

410 mWatt

SOT-23

Unit

：

inch(mm)

• Planar Die construction

• 410mW Power Dissipation

• Zener Voltages from 2.4~75V

• Ideally Suited for Automated Assembly Processes

• Lead free in

compliance with EU RoHS 2011/65/EU directives

• Green molding compound as per IEC61249 Std. . (Halogen Free)

0.056(1.40)

0.047(1.20)

0.120(3.04)

0.110(2.80)

0.006(0.15)MIN.

FEATURES

0.103(2.60)

0.044(1.10)

0.035(0.90)

0.020(0.50)

0.013(0.35)

0.079(2.00)

0.070(1.80)

0.008(0.20)

0.003(0.08)

MECHANICAL DATA

• Case: SOT-23, Molded Plastic

• Terminals: Solderable per MIL-STD-750, Method 2026

• Polarity: See Diagram Below

• Approx. Weight:

0.0003 ounces,

0.0084 grams

• Mounting Position: Any

0.004(0.10)MAX.

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS(T

=25 C unless otherwise noted)

Parameter

Maximum Power Dissipation (Notes 1) at 25

Typical Thermal Resistance ,Junction to Ambient (Notes 2)

Operating Junction and StorageTemperature Range

Symbol

ΘJA

Value

410

500

-55 to +150

Units

C/W

NOTES:

1. Mounted on 50mmX16mm FR-4 board.

2. Mounted on minimum pad layout (1cmX1cm FR-4 board).

SINGLE

June 14,2011-REV.02

PAGE . 1

0.086(2.20)

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