BZT52-B2V4_R1_00001 datasheet, PDF

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BZT52-B2V4_R1_00001: DescriptionZener Diode,; CategoryDiscrete semiconductor diode; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZT52-B2V4_R1_00001 Overview

Zener Diode,

BZT52-B2V4_R1_00001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	R-PDSO-G2
Reach Compliance Code	compliant
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JESD-30 code	R-PDSO-G2
JESD-609 code	e3
Number of components	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.41 W
Nominal reference voltage	2.4 V
surface mount	YES
technology	ZENER
Terminal surface	Tin (Sn)
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	2.08%
Working test current	5 mA
Base Number Matches	1

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BZT52-B2V4 SERIES

SURFACE MOUNT SILICON ZENER DIODES

VOLTAGE

2.4 to 75 V

olts

POWER

410 mWatts

0.154(3.90)

0.141(3.60)

0.110(2.80)

0.098(2.50)

FEATURES

• Planar Die construction

• 410mW Power Dissipation

• Zener Voltages from 2.4~75V

• Ideally Suited for Automated Assembly Processes

•

Lead free in comply with EU RoHS

2011/65/EU

directives.

• Green molding compound as per IEC61249 Std. . (Halogen Free)

0.028(0.70)

0.019(0.50)

0.071(1.80)

0.055(1.40)

MECHANICAL DATA

• Case: SOD-123, Molded Plastic

• Terminals: Solderable per MIL-STD-750, Method 2026

• Polarity: See Diagram Below

• Approx. Weight: 0.0004 ounces, 0.01 grams

• Mounting Position: Any

0.005(0.12)MAX.

0.008(0.20)MAX.

0.053(1.35)

0.037(0.95)

0.016(0.40)MIN.

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T

=25 C unless otherwise noted)

Parameter

Maximum Power Dissipation (Note 1)

Forward Voltage Drop at I

=10mA

Junction to Ambient (Note 2)

Thermal Resistance

Junction to Lead

Operating Junction Temperature and StorageTemperature Range

Symbol

Value

410

0.9

430

Units

JA

JL

C/W

320

-55 to +150

C a th o d e

A node

NOTES:

1. Mounted on 48 cm

FR-4 PCB .

2. Mounted on an FR-4 PCB, with minimum recommended Pad

May 08,2012-REV.04

PAGE . 1

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