EEWORLDEEWORLDEEWORLD

Part Number

Search

BZQ5256T/R13

Description
Zener Diode, 30V V(Z), 5%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, GLASS, QUADROMELF-2
CategoryDiscrete semiconductor    diode   
File Size97KB,4 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance  

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

Download Datasheet Parametric View All

BZQ5256T/R13 Overview

Zener Diode, 30V V(Z), 5%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, GLASS, QUADROMELF-2

BZQ5256T/R13 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPANJIT
Parts packaging codeMELF
package instructionROHS COMPLIANT, GLASS, QUADROMELF-2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeO-LELF-R2
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Nominal reference voltage30 V
surface mountYES
technologyZENER
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%

BZQ5256T/R13 Preview

Download Datasheet
BZQ5221B SERIES
SURFACE MOUNT ZENER DIODES
VOLTAGE
2.4 to 75 Volts
POWER
500 mWatts
QUADRO-MELF
Unit : inch (mm)
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
.0
67
.7
(1
)
• In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
• Case: Molded Glass QUADRO-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.03 grams
• Mounting Position: Any
• Packing information
T/R - 2.5K per 7" plastic Reel
.020(0.5)
.012(0.3)
.146(3.7)
.130(3.3)
.020(0.5)
.012(0.3)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation at Tamb = 25
Junction Temperature
Storage Temperature Range
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
O
Symbol
P
TOT
T
J
T
S
Value
500
175
-65 to +175
Units
mW
O
C
C
C
O
Parameter
Thermal Resistance Junction to Ambient Air
Forward Voltage at I
F
= 200mA
Symbol
R
θ
JA
V
F
Min.
--
--
Typ.
--
--
Max.
0.3
1.1
Units
K/mW
V
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
STAD-FEB.10.2009
.063(1.6)
.055(1.4)DIA.
PAGE . 1
Four major reasons for the heating of power modules
[p=null, 2, left][color=rgb(63, 63, 63)][font="][size=14px]When you touch the surface of the power module[color=#868686], it feels hot. Is the module broken? Wait a minute, it is a little hot, just be...
仪商城 Integrated technical exchanges
LCR parallel resonance
Why is the Q of an actual LCR parallel resonant circuit W0L/R? While the Q of an ideal LCR parallel resonant circuit is R/W0L?...
msddw Analog electronics
How to implement the 0-10V circuit of the inverter and motor speed control interface?
How to implement the 0-10V circuit of the inverter and motor speed control interface?How competitive is this GP9301/GP8101 solution?...
zjqmyron Motor Drive Control(Motor Control)
BLE over-the-air upgrade
TI CC2541 supports multiple hardware and software to perform air upgrades on it. There are different combinations of hardware.Currently available software includesIt is relatively easy to get the hard...
灞波儿奔 Wireless Connectivity
Module Power Structure Design Guide
The main form of module power supply is DC-DC module, in addition there are AC-DC module, DC-AC (ring current) module. Unless otherwise specified, this article assumes DC-DC module....
鬼谷清泉 Power technology
MSP430G2755 Main Bootloader UART Porting Guide
TI's MSP430 supports online upgrades by loading the Bootloader in the main program. Through the online upgrade function, customers can update the internal program of the MSP430 at any time through an ...
fish001 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号