Yangzhou Yangjie Electronic Technology Co., Ltd. was established on August 2, 2006 with a registered capital of RMB 472 million. In January 2014, the company was listed on the Shenzhen Stock Exchange's Growth Enterprise Market with the stock code 300373. In 2017, the company's operating income was RMB 1.47 billion. The company integrates R&D, production and sales, and is professionally committed to the industrial development of power semiconductor chips and device manufacturing, integrated circuit packaging and testing, etc. The company's main products are various power electronic device chips, power diodes, rectifier bridges, high-power modules, DFN/QFN products, SGT MOS and silicon carbide SBD, silicon carbide JBS, etc. The products are widely used in many fields such as consumer electronics, security, industrial control, automotive electronics, and new energy.
The system's circuit board size is 4X4 cm / Adjustable high-speed sensorless BLDC circuit diagram 22.5V /55A / with undervoltage / overcurrent / high temperature protection.
The circuit diagram of thi...
/ ******************************************//* CNPF *//* CC2540 BlueTooth 4.0 Learning Example *//* Example name: Serial Communication 1 *//* Creation time: 2018/05/25 *//* Description: You can see i...
Balun was created to solve the problem of converting unbalanced ports to balanced ports. Due to the special physical structure of single-ended to differential ports, Balun becomes a special three-port...
TMS320C6678 is an 8-core DSP processor based on KeyStone architecture. The frequency of each CorePac core is up to 1.25 GHz, providing powerful fixed-point and floating-point computing capabilities. A...
A friend's company received a batch of office computers. I accompanied him to the company on the weekend to help test the machines, which actually meant turning on the computers and releasing the syst...
1. Common impedance interference of ground wire
The ground wire on the circuit diagram represents the zero potential in the circuit and is used as a common reference point for other points in the circ...
On September 26, according to the Wuxi Photonic Chip Research Institute of Shanghai Jiao Tong University, on September 25, at the 2024 Integrated Circuit (Wuxi) Innovation and Development Conferenc...[Details]
On April 25, TSMC announced on Wednesday that its new chip manufacturing technology called "A16" will be put into mass production in the second half of 2026, marking the escalation of the competiti...[Details]
On June 12, the Korea Times quoted an insider as saying that OpenAI CEO Sam Altman recently met with Samsung Group Chairman Lee Jae-yong, who was on a business trip to the United States. At the sam...[Details]
On April 11, according to DigiTimes, TSMC's 2nm chip research and development work is on track, and the chips used in the iPhone 17 Pro and iPhone 17 Pro Max to be launched in 2025 will be the firs...[Details]
On August 30, Korean media etnews reported yesterday that Micron will take the lead in launching large-scale production of LPCAMM and MRDIMM memory modules in Xi'an, China.
The report quoted i...[Details]
Infineon Technologies is breaking down the carbon footprint of electronic chips down to the component level, allowing engineers to compare their products according to their impact on the climate.
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As the largest market segment of analog chips, power management chips are enjoying the growth dividend brought by the new energy, intelligence and digitalization waves, especially in the field of...[Details]
On April 19, Samsung Semiconductor published an interview with two executives on HBM memory on its official website in South Korea. During the interview, the two executives stated that Samsung plan...[Details]
On June 27, South Korean media Business Korea reported on June 24 that Samsung Electronics' semiconductor packaging industry has made significant progress and will lead TSMC in entering the panel-l...[Details]