2SC4944Y datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> The transistor> 2SC4944Y

2SC4944Y: DescriptionSmall Signal Bipolar Transistor; CategoryDiscrete semiconductor The transistor; File Size199KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet Parametric View All

2SC4944Y Overview

Small Signal Bipolar Transistor

2SC4944Y Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknow
Base Number Matches	1

2SC4944Y Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-353 Plastic-Encapsulate Transistors

2SC4944

DUAL TRANSISTOR (NPN+NPN)

SOT-353

Features

Small package (dual type)

High voltage and high current

High h

FE,

excellent

linearity

Complementary to 2SA1873

Marking: LY LGR

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current -Continuous

Collector Power Dissipation

Junction Temperature

Storage Temperature

Value

150

200

150

-55 to150

Units

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

Collector-emitter saturation voltage

Transition frequency

Collector output capacitance

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

CE(sat)

Test conditions

=100μA,I

=1mA,I

=100μA,I

=60V,I

=5V,I

=6V,I

=2mA

=100mA,I

=10mA

=10V,I

=1mA

=10V,I

=0,f=1MHz

3.5

120

Min

0.1

400

0.25

MHz

Typ

Max

Unit

μA

CLASSIFICATION OF h

Rank

Range

Marking

120-240

200-400

LGR

A,Dec,2010

Recommended Resources

Capacitive proximity switch circuit

Fully automatic 6V battery charger circuit

Adjustable current source circuit diagram using op amp

Multi-reed switch signal input

Typical valve regulated sealed lead-acid battery charging process curve

C2000 built-in comparator error sources and correction methods--F28004x, F2807x, F2837x: C2000 series chips are widely used in digital power supply and motor control, in which overcurrent and overvoltage protection are essential. TI's Picollo series chips, starting from F2802x, have integ...; Jacktang Microcontroller MCU

Problems with burning programs: I have a problem with burning the program, the prompt is as follows:I searched a lot on the Internet, but none of them work. It used to work, but after I moved, it stopped working. Please give me some...; chenbingjy stm32/stm8

Common problems and countermeasures for CCS commissioning: 1. Use SEED_XDS510PLUS for CCS simulation Question: When using routine simulation, I couldn't find the 510 option because I was using CCS6.2. Solution: I later searched online and found that XDS510 su...; Jacktang Microcontroller MCU

Analysis of the working principle of anti-interference filter: With the rapid development of electronic technology and the rapid increase of electronic equipment, the electromagnetic environment is deteriorating day by day. A large number of electronic equipment ...; Aguilera Analogue and Mixed Signal

【TMS320 frequency measurement】First post for newbies! TMS320F28369D Launchpad unboxing + knowledge popularization: First post for a newbie! I applied for a development board for the first time in my life! I'm so excited! https://en.eeworld.com/bbs/thread-1143979-1-1.html The guy in the front row gave up, and then ...; com0104988 Microcontroller MCU

PiSugar Battery - Raspberry Pi Zero Portable Power Platform: The Raspberry Pi Zero is small, but its power bank may be five times bigger, but it is not cute. PiSugar is a battery project designed specifically for Pi Zero. It is very easy to use, no soldering re...; Jacktang Analogue and Mixed Signal

Popular Components