2SB1426 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> 2SB1426

2SB1426: DescriptionPNP transistor; CategoryDiscrete semiconductor; File Size131KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

2SB1426 Overview

PNP transistor

Features

Product Name: PNP Transistor

Product model: 2SB1426

Product parameters:

Pcm (maximum power dissipation): 750mW

Ic (collector current): 3000mA

BVcbo (collector-base breakdown voltage): 20V

BVceo (Collector-Emitter Breakdown Voltage): 20V

BVebo (emitter-base breakdown voltage): 6V

hFE (current gain): Min:82, Max:390

VCE (sat) saturation voltage drop: 0.5V

fT (transition frequency): 240+MHz

Package: TO-92

Recommended Resources

Delay bedside lamp circuit with hypnotic device

hid electronic ballast circuit diagram

ZH3140 radial drilling machine electrical schematic circuit (2)

Lithium battery boost circuit diagram

Automatic parallel charger

555 power system cycle measurement circuit

Temperature Problems Solved for You (VI) Design Challenges of Wearable Temperature Sensing: In previous articles, we have covered the basics of temperature sensors. Knowing a patient’s temperature is a critical first step in any clinical diagnosis and is an important concern for athletes. In...; EEWORLD社区 TI Technology Forum

Advanced tips for analog and vector signal generators: Usually, the simple application of RF signal source is just input frequency, power, plus some analog and digital modulation, but to fully tap the potential and performance of the signal source require...; btty038 RF/Wirelessly

【TI Recommended Course】#Smart Building Wireless Solutions#: //training.eeworld.com.cn/TI/show/course/5720...; czhuangwei TI Technology Forum

Research on the application of SVPWM generated by DSP in inverter power supply: Abstract: A method of using DSP to generate SVPWM wave to realize full digital control of inverter power supply is proposed. Based on the analysis of the characteristics of TMS320LF2407A digital signa...; zbz0529 Power technology

Arteli AT32WB415 peripheral use (ultrasonic module): [i=s]This post was last edited by LYU4662 on 2022-8-8 16:46[/i]After setting up the environment last week and lighting up a lamp, I am going to learn some peripherals this time. I bought an ultrasonic...; LYU4662 RF/Wirelessly

Analysis of Microstrip Patch Antennas on Arbitrarily: Abstract—A numerical procedure for the efficient analysis ofmicrostrip antennas and feed networks embedded in multilayerstructures of arbitrary shape is presented. It is based on a specialvariant of t...; JasonYoo RF/Wirelessly

Popular Components