2N5088 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> 2N5088

2N5088: DescriptionNPN transistor; CategoryDiscrete semiconductor; File Size114KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

View All

2N5088 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	2N5088	-	-	View	Buy Now

2N5088 Overview

NPN transistor

Features

Product Name: NPN Transistor

Product model: 2N5088

Product parameters:

Pcm (maximum power dissipation): 350mW

Ic (collector current): 50mA

BVcbo (collector-base breakdown voltage): 35V

BVceo (Collector-Emitter Breakdown Voltage): 30V

BVebo (emitter-base breakdown voltage): 4.5V

hFE (current gain): Min: 300, Max: 900

VCE (sat) saturation voltage drop: 0.5V

fT (transition frequency): 50MHz

Package: TO-92

2N5088 Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-92 Plastic-Encapsulate Transistors

TO – 92

2N5088

TRANSISTOR (NPN)

1. EMITTER

FEATURES

General Purpose Amplifier Transistor

High DC Current Gain

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

θJA

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current

Collector Power Dissipation

Thermal Resistance From Junction To Ambient

Junction Temperature

Storage Temperature

Value

4.5

0.05

350

357

150

-55~+150

2. BASE

3. COLLECTOR

Unit

℃/W

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

FE(1)

DC current gain

FE(2)

FE(3)

Collector-emitter saturation voltage

Base-emitter voltage

Collector output capacitance

Transition frequency

CE(sat)

Test

conditions

Min

4.5

Typ

Max

Unit

= 0.1mA,I

=1mA,I

=0.1mA,I

=20V,I

=15V,I

=3V,I

=4.5V,I

=5V, I

=0.1mA

=5V, I

=1mA

=5V, I

=10mA

=10mA,I

=1mA

=5V, I

=10mA

=5V,I

=0, f=100KHz

=5V,I

=0.5mA, f=20MHz

100

300

350

300

0.5

0.8

900

Emitter cut-off current

MHz

*Pulse test: pulse width

≤300μs,

duty cycle≤ 2.0%.

A,Dec,2010

Recommended Resources

LB1405, 15-level display circuit (a) amplification part

Current output light detection circuit

A simple indoor humidity controller design

Simultaneously output 12v voltage stabilizing circuit

9V charger with preset charging termination voltage

Use the battery to identify the head and tail of the motor winding

Application of high-performance line cards for synchronous networks: In a distributed network, the uncertainty of network transmission delay leads to poor synchronization accuracy when triggered by network commands. At the same time, due to the dispersion of the locati...; alan000345 TI Technology Forum

After 30 years, China has finally reached the United States: When I was watching the news the day before yesterday, what caught my eye the most was, haha~~~, a "normal" economic news: Lenovo International's Yang Yuanqing "angrily" accused the US congressman of ...; zz123 Talking

Analysis of AC-coupled op amp circuits: [i=s] This post was last edited by fdsf on 2022-10-5 13:27[/i]Here are the pictures first.Where Z1 is the impedance of C1 and R1 in series, and Vdc is the DC component of the input signal Vin. I want ...; 反倒是fdsf Analog electronics

Let’s chat: Qinheng PD fast charging protocol chip online customization platform is launched, are you interested?: Guan Guan saw the news shared on Qin Hengjia’s official account: The online customization platform for PD fast charging protocol chips is launched. It sounds interesting. Are you interested in this? ?...; okhxyyo Power technology

ST NUCLEO-L452RE free trial is here: Development board for this event: ST NUCLEO-L452RE Source: STMicroelectronics Number of development boards: 4ST NUCLEO-L452RE STMicroelectronics STM32L4 32-bit MCU + FPU is an ultra-low-power microcon...; okhxyyo stm32/stm8

Screen interface: Screen interface FSMC, 8080, RGB, MIPI, PPI, IIC, SPI, serial screen, LVDS interface, EDP interface, HDMI, MPU interface, M6800 mode, VSYNC mode, MDDI mode, DSI modeDo you first confirm that a certain...; QWE4562009 Discrete Device

Popular Components