EEWORLDEEWORLDEEWORLD

Part Number

Search

1N5264B-35B

Description
Zener Diode, 60V V(Z), 5%, 0.5W, Silicon, Unidirectional, DO-35, ROHS COMPLIANT, GLASS PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size80KB,3 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

Download Datasheet Parametric View All

1N5264B-35B Overview

Zener Diode, 60V V(Z), 5%, 0.5W, Silicon, Unidirectional, DO-35, ROHS COMPLIANT, GLASS PACKAGE-2

1N5264B-35B Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeDO-35
package instructionO-LALF-W2
Contacts2
Reach Compliance Code_compli
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-35
JESD-30 codeO-LALF-W2
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage60 V
surface mountNO
technologyZENER
Terminal formWIRE
Terminal locationAXIAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current2.1 mA
Base Number Matches1

1N5264B-35B Preview

Download Datasheet
DATA SHEET
1N5221B~1N5267B
SILICON ZENER DIODES
VOLTAGE
2.4 to 75 Volts
POWER
500 mWatts
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
Lead free in comply with EU RoHS 2002/95/EC directives
MECHANICAL DATA
• Case: Molded Glass DO-35
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.13 grams
• Mounting Position: Any
• Ordering information: Suffix : “ -35 ” to order DO-35 Package
• Packing information
B
- 2K per Bulk box
T/R - 10K per 15" plastic Reel
T/B - 5K per horiz. tape & Ammo box
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
P ar m et r
a
e
P ow erD i si aton atTam b = 25
s p i
Juncton Tem per t r
i
aue
S t r ge Tem per t r R ange
oa
aue
Vald pr vi ed t atl ads ata di t nce of8m m fom case ar keptatam bi ntt m per t r .
i o d
h e
sa
r
e
e e
aue
O
S ym bol
Val e
u
500
175
- 5 t +175
6 o
U nis
t
mW
O
C
P
TO T
T
J
T
S
C
C
O
Parameter
Thermal Resi stance Juncti on to Ambi ent Ai r
Forward Voltage at I
F
= 200mA
Symbol
Mi n.
--
--
Typ.
Max.
0.3*
1.1
Uni ts
K/mW
V
R
θ
JA
V
F
--
--
Vali d provi ded that leads at a di stance of 10 mm from case are kept at ambi ent temperature.
STAD-NOV.08.2006
PAGE . 1
Sugar glider ③ RSL10-SENSE-GEVK light sensor driver is written and shared with everyone
The last post was posted in May. A brief introduction to the RLS10 sensor board from ON Semiconductor, and a question was also raised So why did the initialization of the light sensor fail? Logically ...
justd0 onsemi and Avnet IoT Innovation Design Competition
《GaN Transistors for Efficient Power Conversion》
Who has this book? "Chinese" 《GaN Transistors for Efficient Power Conversion》...
btty038 RF/Wirelessly
Pad hole attribute problem
[If you don't understand, ask] The picture to be drawn is the size and shape of the holes and pads of the DIP package. There are three arrows in this column as shown in the figure below. What do they ...
shaorc PCB Design
Power Amplifier Modules and Their Role in 5G Designs
5G is one of the most important and powerful technologies ever introduced to the wireless communications market. With significant improvements in data rate, latency, and capacity compared to 4G, 5G is...
兰博 RF/Wirelessly
Learn more about the SimpleLink MCU Platform Tools and Development Kits (Rev. B)
Today, the Internet of Things (IoT) market is more competitive than ever. End users demand more functionality and features while expecting lower cost and size without compromising battery life. Soluti...
Jacktang Wireless Connectivity
[Anxinke NB-IoT Development Board EC-01F-Kit] 1. Unboxing
[i=s]This post was last edited by xiyue521 on 2022-1-19 01:08[/i]I believe everyone has heard of ESP8266 . I have used Essence ESP 12F and VB series voice modules before. Recently, Essence launched th...
xiyue521 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号