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According to foreign media reports, Germany's Bosch Group said on Wednesday that it will acquire the assets of US chip manufacturer TSI Semiconductor to expand its silicon carbide chip (SiC) semicond...[Details]
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Shanhai Semiconductor completes financing of over 10 million US dollars and launches internationally advanced signal chain products
Domestic high-performance mixed-analog and signal ...[Details]
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Infineon and ASE jointly announced today that the two parties have signed a final agreement. According to this agreement, Infineon will sell two back-end manufacturing bases in Cavite, Philippines an...[Details]
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Standard Technology Corporation, a subsidiary of Qisda Group's Luo Sheng Enterprise, participated in the Semicon China 2024 exhibition, showcasing a number of innovative products that help optimize...[Details]
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Samsung Display President Choi Joo-sun said at a meeting with executives and employees at Giheung Campus in Yongin, Gyeonggi Province, South Korea, earlier this month that the company has increased t...[Details]
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Xinhua News Agency, Jerusalem, July 9th. The Israel Institute of Technology recently issued a communiqué saying that a new research led by its staff has developed a new material that may replace si...[Details]
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According to the Nikkei Asian Review, Huawei Technologies Co., Ltd. and its suppliers are working day and night to stock up enough key chips before the deadline set by the US government. The lea...[Details]
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Market research firm SEMI believes that 2021 will be a landmark year for global wafer fabs, with equipment spending expected to grow by 24% to a record high of $67.7 billion, 10% higher than the prev...[Details]
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At the Flash Memory Summit (FMS) 2023 held in Santa Clara from August 8 to 10, SK Hynix introduced the development progress of its 321-layer 1Tb TLC* 4D NAND flash memory and displayed samples. SK hy...[Details]
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On August 9, according to Taiwan’s Economic Daily, TSMC announced yesterday that in response to strong market demand for advanced processes, the Kaohsiung plant has determined its production plan wit...[Details]
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SK Hynix announced that it has completed the performance verification of LPDDR5T memory with MediaTek’s next-generation Dimensity flagship mobile platform. The next-generation Dimensity flagship mobi...[Details]
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On August 28, panel company AU Optronics (AUO) issued an announcement yesterday, stating that it would sell several factories of the company and its subsidiary AUO Crystal in Tainan and Taichung, T...[Details]
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The much-anticipated Lattice Developer Conference is coming soon, and Lattice has just announced the full agenda of the conference. During the three days from December 5th to 7th, a series of excitin...[Details]
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The new U.S. trade policy targeting Huawei has unraveled the web of relationships between the electronics industry and global trade, posing a threat to the U.S. leadership in the semiconductor indust...[Details]
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Translated from EEtimes During this pandemic, it’s not easy to be blind for the CEO of a global chip company with a market value of $8.88 billion. NXP’s new CEO Kurt Sievers feels the same way. I...[Details]