Introduction to Common PCB Microvia Technology

捷多邦PCB技术

Introduction to Common PCB Microvia Technology [Copy link]

With the improvement of product performance, PCB is also constantly updated and developed, and the lines are becoming more and more dense. "]There are more and more components that need to be placed, but the size of the PCB will not only not increase,

but it will become smaller and smaller.

So, if you want to drill holes in the plate at this time, you need considerable skill. There are many PCB drilling technologies,

The traditional method,

making inner layer blind holes,

When laminating multi-layer boards one by one, first use two double-sided boards with through holes as the outer layer, and press them with the inner layer boards without holes, and then press them with the inner layer boards without holes. "]The blind holes filled with glue will appear, while the blind holes on the outer board surface are drilled by mechanical drilling. However, when making machine-drilled blind holes, it is not easy to set the drilling depth of the drill bit, and the tapered bottom of the hole affects the effect of copper plating.In addition, the process of making inner layer blind holes is too lengthy, which wastes too much cost. Traditional methods are becoming less and less suitable. BlinkMacSystemFont, "]The commonly used PCB microvia technology, in addition to carbon dioxide drilling

and laser drilling,

there are also mechanical drilling,

Photosensitive hole forming, laser drilling, plasma hole forming and chemical hole forming, etc.

Mechanical drilling

is made by high-speed mechanical processing,

the most important of which is the drill bit,

The drill bit is generally made of tungsten-cobalt alloy. The alloy is based on tungsten carbide powder, cobalt as a binder, and is sintered at high temperature and high pressure. "]It has high hardness and high wear resistance,

and can smoothly drill the required holes.

Laser drilling

is the use of carbon dioxide,

It is made by ultraviolet laser cutting.

Gas or light forms a beam,

with powerful thermal energy,

which can burn through copper foil,

The required holes can be made.

The principle is the same as cutting,

The main purpose is to control the light beam.

Plasma is also known as plasma. The particles that make up plasma are widely spaced and are in constant collision in an irregular manner. Its thermal motion is similar to that of ordinary gas.

Plasma Etching

It is mainly used for PCB with resin copper layer.

It uses oxygen-containing gas as plasma.

[font=-apple-system-font, After contacting with copper, an oxidation reaction will occur, which will remove the resin material to form holes. Objects remaining on the PCB,

cannot be cleaned by general methods,

can be cleaned by chemical cleaning,

"]Let the chemical react with the residue and

it can be removed. The same is true for drilling. Use chemical agents, drop them where holes need to be drilled, and then apply them. "]The copper foil, resin, etc. can be eroded, and holes will be formed eventually.

qwqwqw2088

The font of the post is centered, it looks like a long poem,,,

捷多邦PCB技术

qwqwqw2088 posted on 2018-9-12 20:49 The font of the post is centered, it looks like a long poem,,,

The color language has an artistic feel