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This post was last edited by 1055875333 on 2018-5-2 09:04 In actual operation, the following methods are used to dissipate heat: 1. Add a heat sink to the surface of the main chip with high temperature. 2. Add thermal conductive silicone to the surface of the main chip with high temperature. 3. If the product structure and cost allow, consider adding a cooling fan. 4. Let the system work in a relatively ideal load state, do not run it at full load or overload.
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