Infineon launches compact IGBT module to reduce stray inductance by 60%

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Infineon launches compact IGBT module to reduce stray inductance by 60% [Copy link]

Infineon Technologies has launched a compact IGBT (insulated gate bipolar transistor) module series, providing optimized power converter system solutions for various industrial transmission devices, windmills, elevators or auxiliary transmission equipment, locomotive and train power supply and heating system transmission devices. The PrimePACK module based on the innovative packaging concept fully utilizes the advantages of Infineon's new generation IGBT4 chip.

In this innovative module design, the IGBT4 chip is closer to the substrate fastening point, reducing the thermal resistance between the substrate and the heat sink. Based on these characteristics, the internal stray inductance can be reduced by about 60% compared to traditional modules. Reducing stray inductance is very important for eliminating spike overvoltage. The unique layout greatly improves the heat distribution and achieves low thermal resistance performance of the entire module system. The maximum operating temperature is increased from +125℃ to +150℃, which is much higher than that of previous modules. Infineon has also reduced the minimum storage temperature of this module from the previous -40℃ to -55℃. The new IGBT module for power converter applications can also increase the rated current by about 20% under the same blocking voltage or module size, or achieve the same power loss in a relatively small volume.

At present, Infineon has launched two voltage levels of PrimePACK modules, 1,200V and 1,700V, each module has two sizes: 89mm×172mm and 89mm×250mm. The half-bridge configuration and modular design of the PrimePACK module make it easy for users to proportionally change the power of the converter, such as selecting different module sizes or connecting modules of specific models together. The weight of the two modules is 45% lighter than traditional modules of the same power, which makes the design and installation of power converters simpler.

“With the PrimePACK modules, Infineon is once again rewriting the industry standard for power modules and is therefore better able to meet the needs of our customers,” said Martin Hierholzer, Head of Industrial Power Electronics at Infineon Technologies. “The innovative module design, fully optimized for system integration, combined with the new generation of high-performance IGBT4 chips manufactured using the TrenchStop process, optimizes our latest module series to significantly increase the efficiency and durability of all types of industrial drive systems.”

The industrial drive market has great growth potential. According to a research report by IMS Research, the global industrial drive market is expected to grow from $8.5 billion in 2005 to $9.4 billion in 2008, an average annual growth of 6%. The use of modern power semiconductors in drive systems can significantly reduce power consumption. For example, the application of electronic drive control can save an average of 40% of power per motor.

The launch of PrimePACK further expands the lineup of Infineon's power module series, which now includes compact 1,200V and 1,700V products with a power range between the 200kW 62mm product series and the mature IHMA modules above 300kW. The rated storage temperature of -55℃ and the maximum operating temperature of +150℃ enable PrimePACK modules to maintain normal operation in extremely harsh environments. These modules are produced in Warstein, Germany, and IGBT diodes and IGBT chips are manufactured in Villach, Austria.

Samples of the 1,200V and 1,700V PrimePACK modules are available now, with volume production expected in the first quarter of 2007. The modules are RoHS-compliant and meet the flameproof requirements of NFF16-101 and 16-102.