Standard requirements for temperature and humidity in SMT workshops

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Standard requirements for temperature and humidity in SMT workshops [Copy link]

Standard requirements for temperature and humidity in SMT workshops

The SMT processing workshop has very strict requirements on temperature and humidity. Appropriate temperature and humidity are key factors to ensure welding quality. If the temperature and humidity control in the production workshop is unreasonable, it will affect the quality of welding, damage the components of electronic products, and cause the entire PCBA board circuit to be defective. Next, Sichuan Yingteli editor will take you to understand the temperature and humidity requirements of the SMT workshop.

• Temperature and humidity requirements

The optimal temperature of the SMT workshop is 25±3 degrees Celsius

The best humidity in the SMT workshop is 45±15% relative humidity

• Harm caused by unreasonable temperature and humidity control

High humidity:

High humidity in manufacturing environments can cause many serious problems:

Slumping: Solder paste accepts too much water and causes bridging during reflow.

Solder balls (or "popcorn"): Excessive water absorption into the solder paste, resulting in poor coalescence.

Outgassing: Excessive moisture under the ground support, especially under the BGA, can cause pressure to build up. In some cases, the cover may be blown off.

Low humidity:

The flux evaporates too quickly, causing the solder paste to dry out. This in turn causes poor stencil release and inadequate solder joint defects.

high temperature:

As the temperature decreases, the solder paste viscosity decreases. This can cause a number of problems: primarily paste smearing and collapse - but also defects such as bridging and solder balls, for example, can result. High temperatures can also cause additional oxidation of the solder, which can affect

Affects solderability.

Low temperature:

If the temperature is too low, solder paste viscosity may increase. This can cause undesirable printing behaviors such as release and rolling, as well as print voids where the paste is too firm to print properly.

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