Problems with component screening and classification

shaorc

Problems with component screening and classification [Copy link]

When conducting a secondary screening of electronic components, I saw a document that divided integrated circuits into two categories: hermetic and non-hermetic. However, after checking the national military standard, I found that there are only two categories of integrated circuits: monolithic integrated circuits and hybrid integrated circuits. How do they correspond? In particular, how are hermetic and non-hermetic types defined?

fish001

Searched for reference:

Microelectronic devices are divided into hermetic packaging and non-hermetic packaging in terms of sealing. High-level integrated circuits and discrete devices usually use hermetic packaging, mostly metal, ceramic, glass packaging, with a cavity structure inside, filled with high-purity nitrogen or other inert gases, and also contains a small amount of other gases. Industrial-grade and commercial-grade devices usually use plastic packaging technology, without a cavity, and the chip is completely wrapped by polymer materials, which is a non-hermetic packaging.

In general, the reliability of hermetic components is more than one order of magnitude higher than that of non-hermetic components. Hermetic components are generally strictly controlled in design, production, testing, inspection and other links according to military standards and aerospace standards. They have low failure rates and are mostly used in high-reliability application fields. Non-hermetic components are generally suitable for civilian electronic products with good environmental conditions and low reliability requirements. Hermetic components have good heat dissipation and stronger environmental adaptability. The rated working environment temperature of military and aerospace components can reach -55℃~+125℃. Plastic-sealed non-hermetic components have poor heat dissipation. According to different application fields, they are generally divided into commercial and industrial grades. The rated working environment temperature of commercial grade is 0℃~70℃, and the rated working environment temperature of industrial grade is -40℃~85℃. There are also some industrial-grade plastic-sealed components with an upper working temperature limit of +125℃, reaching the military temperature level. There is a small amount of water vapor inside the cavity of hermetic components. The national military standard and the US military standard have made clear restrictions on the internal water vapor content, stipulating that the internal water vapor content cannot exceed 5000ppm. This is because high water vapor content may cause some reliability problems, including internal chemical contamination, accelerated corrosion of internal metals, mainly damage to leads and bonding areas without passivation layer protection, and may also cause component insulation performance degradation or parameter deviation. Low temperatures may cause relay function failure. Excessive internal water vapor content has caused multiple batches of component failures and led to extremely serious system disasters.

se7ens

I feel that the airtight packaging is not reliable

If there is a temperature change or improper use, it may explode or crack

qwqwqw2088

Aerospace devices require airtightness

shaorc

fish001 posted on 2021-8-17 11:14 Searched, for reference: Microelectronic devices are divided into hermetic packaging and non-hermetic packaging from the perspective of sealing. High-level integrated circuits and discrete devices are usually...

Thank you, I understand.