FPC flexible circuit board laser cutting machine
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The laser cutting machine has three main functions in the processing of flexible circuit boards (FPC): FPC shape cutting, cover film window opening, drilling, etc. When using it, customers can directly use any path diagram data for FPC laser cutting, which is more convenient and faster and can greatly shorten the delivery cycle.
Features and advantages of FPC laser cutting machine in this regard:
When opening windows in the FPC cover film, the cut cover film has neat and round edges, is smooth and has no burrs or overflowing glue. When using molds and other machining methods to open windows, it is inevitable that there will be burrs and overflowing glue near the window after punching. Such burrs and overflowing glue are difficult to remove after the pads are pressed and bonded, which will directly affect the subsequent coating quality. The processing of flexible board samples often leads to changes in the cover film window due to customer needs to modify the circuit and pad position. The traditional method requires the replacement or modification of the mold. However, this problem can be easily solved by using laser processing, because you only need to import the modified path map data to easily and quickly process the cover film with the window pattern you want, which will give you a competitive advantage in market in terms of time and cost.
FPC laser cutting machine has high processing accuracy and is an ideal tool for forming flexible circuit boards. The focused laser can process materials into any shape. In the past mass production, many small parts were formed by mechanical hard stamping molds. However, the large loss and long delivery cycle of the hard stamping die method are impractical and costly for the processing and forming of small parts. FPC laser cutting machine can solve the production needs of enterprises in this regard.
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