Is it better to use copper or silver paste for flexible circuit boards?
[Copy link]
On flexible printed circuit boards (FPC), the choice of copper or silver paste depends on the application requirements of the circuit and cost considerations. Both have advantages and disadvantages:
1. Conductivity: Copper coating: Copper coating has stronger conductivity and can carry higher current. Therefore, copper coating has better effect in circuits that require high conductivity and low resistance. Silver paste: The conductivity of silver paste is slightly lower than that of copper coating, and it is more suitable for circuits with lower current. However, due to the inherent good conductivity of silver, silver paste can still meet the needs of flexible circuits with low current requirements.
2. Durability and reliability: Copper coating: It has higher durability and adhesion, and is stable in high temperature, humid and other environments, suitable for applications requiring high durability. Silver paste: Silver paste circuits may be affected by the environment (such as oxidation or humidity) during use, resulting in decreased conductivity and relatively low reliability.
3. Cost: Copper coating: Relatively high cost, complex manufacturing process, but provides better electrical performance. Silver paste: Low cost, suitable for flexible circuits with economical requirements, and has cost advantages in simple circuits.
4. Process flexibility: Copper coating: suitable for more complex circuits, strong adaptability, but more complex processing. Silver paste: the process is relatively simple, suitable for circuits with low production process requirements and simple structure.
If the flexible circuit board requires high conductivity, high current carrying capacity and environmental tolerance, copper cladding is a better choice; if the circuit structure is simple, the current demand is low and the cost is sensitive, silver paste is a more cost-effective choice.
|