What is the difference between Pcb design file Via and Pad

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What is the difference between Pcb design file Via and Pad [Copy link]

via is called via hole, which is divided into through hole, blind hole and buried hole. It is mainly used to connect wires in different layers of the network and cannot be used as plug-in hole to weld components.

via hole does not make aperture control in the production process, (JLC currently does not process blind holes and buried holes, only through holes)

pad is called pad, which is divided into pin pad and surface mount pad; pin pad has solder hole, which is mainly used to weld pin components; while surface mount pad has no solder hole, which is mainly used to weld surface mount components.

The aperture of the pad hole is controlled during the production process, with a tolerance of plus or minus 0.08mm.

The via mainly serves as an electrical connection. In actual production, it may be compensated by increasing the size of the hole and producing with a knife close to the hole, reducing the number of knives and improving work efficiency. It may also be reduced to meet production requirements due to limited line spacing and line width

space. The aperture of the via is generally small, and it is usually sufficient as long as the board processing technology can do it. The surface of the via can be coated with solder mask or not; the pad not only serves as an electrical connection, but also serves as a mechanical fixation. The aperture of the pad must be large enough to pass through the pins of the component, otherwise it will cause production problems; in addition, there must be no solder mask on the surface of the pad, because this will affect welding, and the hole tolerance control of plus or minus 0.08mm or more or less will result in an unstable installation.

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