The main chip RTL8367RB-VB-CG (hereinafter referred to as "8367 chip") is one of the network management chips launched by REALTEK. The chip can provide 5 layer 2 network management ports, 2 10/100/1000M switch controllers and 1 51-core hardware resources.
This project mainly uses five of the layer 2 network management ports, and only involves configuring the self-test status of the chip when it is powered on and reset on the hardware.
Design and develop a configuration-free 5-port 1000base Ethernet switch using the 5 layer 2 network management ports of the 8367 chip. Provide appropriate power to the board, and the board will work normally and enable five Ethernet devices to communicate with each other.
Power supply:
Temperature:
The Ethernet switch produced in this project was used to connect to the home network, and the network speed was tested, and it basically matched the speed of the package.
1. Two-color LED speed indication design
According to the two-color LED solution in the manual , I designed the two-color light on the RJ-45 network port this time. What I understand is that LED2 is for Gigabit speed, and LED1 is for 100M and below. When powered on, the LED1 and LED2 inputs are high, and then when the network port is connected for speed judgment: when a gigabit device is connected, LED2 is low, LED1 is high, and then the green light should be on, but in fact it is on orange. Colored lights, so the Gigabit and Hundred Mbit LEDs should be LED1 and LED2 respectively .
2. LDO
Power requirements of 8367 chip
According to this table, two typical power supplies are selected: 3.3V and 1.1V .
Typical applications of 1117-3.3 chips
The actual application is basically the same as the typical application in the manual
Typical applications of VRH1102LTX chip
The actual application is basically the same as the typical application in the manual
When debugging the trial switch, I found that the heat generated by several LDOs was relatively large. It was estimated that the current of the power supply was not derated enough and was approaching the limit of the LDO chip.
There is also a problem with the cooperation between the housing designed in the PCB file and the TYPE-C interface. After installing the housing and connecting the type-C , I found that the DEMO board cannot provide power.
Currently, these three areas of DEMO have not been properly handled, but other functions can still be implemented. You can modify and modify it on this basis.
Devices | Class | introduce | Datasheet |
---|---|---|---|
RB1-ZZ-0080 | Download | ||
RC1210FR-071ML | Passive components;The resistor | Fixed Resistor, Metal Glaze/thick Film, 0.5W, 1000000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1210, CHIP | Download |
FV32X103K202EGQ | Download | ||
CBM160808U600T | Passive components;Magnetic beads | Impedance @ Frequency: 60Ω @ 100MHz Number of Lines: 1 Rated Current (Max): 3A DC Resistance (DCR) (Max): 40mΩ | Download |
RC1210FR-070RL | Passive components;SMD resistor | Resistance (ohms): 0 Accuracy: ±1% Power: 1/2W Temperature coefficient: - | Download |
RC0603FR-071KL | Passive components;The resistor | Resistance (ohms): 1K Accuracy: ±1% Power: 1/10W Temperature coefficient: ±100ppm/°C | Download |
DTSAM-65R-S-Q-T/R | Download | ||
VRH1102LTX | Download | ||
HC-TYPE-C-6P-01A | The USB connector | Download | |
HC-DC-005-2.0M | Download | ||
JK-SMD0805-100/6V | Download | ||
RC0603FR-072K49L | Passive components;The resistor | Resistance (ohms): 2.49K Accuracy: ±1% Power: 1/10W Temperature coefficient: ±100ppm/°C | Download |
CS-1110-1*6 | Download |
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