This topic mainly introduces how to transplant the Linux operating system on arm, including bootloader, upper-layer application development, etc., how to build a Linux development environment, and the selection of arm chips, etc.
Another year has passed in a flash. Suddenly I found that CMSIS-DAP has V2 version, and the implementation mechanism is exactly the same as the BULK protocol I defined before, but the BOS feature is a
I am new to FPGA SOC and bought a Terasic DE1 board. My system is WIN7 X64. I installed Quartus primer 17, SOCEDS and DS-5. When I ran the graphic reading example demo1_axi in the training material, I
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:59[/i]The thermal conductive medium materials traditionally used in electronic equipment mainly include thermal grease, thermal silica
PC encounters development bottleneck and falls into homogeneity and price war 2006-7-13Recently, at the launch ceremony of Lenovo's new commercial computers, Lenovo China President Chen Shaopeng publi
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