Safe and reliable automotive OTA upgrade solutions unleash the unlimited potential of connected vehicles

As software-defined vehicles (SDVs) rapidly evolve, achieving seamless connectivity while maintaining and managing a steady stream of data has become a key challenge, and the way the automotive industry uses analytics and machine learning to gain and use insights has also changed accordingly.

OEMs need tools to keep pace with ongoing change and unlock the potential of connected cars for over-the-air (OTA) software updates and data collection to improve the driving experience and drive profitability.

NXP Semiconductors, together with Excelfore and Tessolve, has jointly tackled this challenge and developed an innovative concept for AUTOSAR and non-AUTOSAR applications: integrating Excelfore's SDVconnect framework, Tessolve's TERA platform, and NXP S32G-based system solutions. Their goal is to combine SDVconnect's car-to-cloud connectivity solutions and cloud-based device management applications with TERA's sensor-to-cloud connectivity and CAN and Ethernet, while also having storage capabilities.

Solutions for automotive OTA upgrades

On the one hand, SDVconnect provides secure, standardized cloud-to-edge device management and a comprehensive edge-to-cloud connectivity solution. It leverages Excelfore’s experience in pioneering high-performance managed Ethernet connectivity in the automotive edge space.

On the other hand, the service-oriented gateway of TERA application realizes large-scale bridging of data to real-time predictions, connecting vehicle data with the cloud through 4G/5G interface, all of which relies on Tessolve's expertise and end-to-end innovation capabilities in the engineering field.

Prior to this collaboration, Excelfore's SDVconnect software had difficulty finding a solution that integrates a hardware computing platform and a network switch. Tessolve's TERA platform fills this gap, providing a comprehensive system platform that includes computing, storage, networking and connectivity solutions, enabling CAN data to be smoothly connected to the cloud. The capabilities of NXP's S32G2/G3 chips support this solution while providing a powerful system solution for the next generation of automotive electronic and electrical architectures.

To promote the transformation of automotive data, Excelfore and Tessolve use NXP S32G3 chips to explore safe and reliable OTA software upgrade solutions. For more information about S32G3, click here>>

Collaboration: The key to success for next-generation vehicle architecture

The car-to-cloud collaboration fully integrates Excelfore's eSync OTA and eDatX data aggregation solutions. In addition, the TERA system platform is now integrated with AWS IoT Greengrass, an open source edge runtime cloud service that helps build, deploy and manage smart device software.

The collaboration enables manufacturers to quickly evaluate and deploy using the production-ready NXP software development kit (SDK), enabling rapid development and integration, faster customer deployment and meaningful adoption.

NXP, Excelfore and Tessolve are working to provide scalable solutions for different markets, address various challenges and enhance customer value. The success of the partnership proves the power of collaboration in the transformation of automotive technology. They are unleashing the potential of the connected car.

About Excelfore SDVConnect

Excelfore is headquartered in Silicon Valley and has offices in Shanghai, Frankfurt, Tokyo and Bangalore. Excelfore's customers include the world's top OEMs and suppliers in the automotive industry, and its solutions are used in millions of vehicles around the world. Excelfore's SDVconnect product line accelerates the development of automotive data services by combining edge systems with the cloud. Excelfore's innovative solutions include eSync OTA, eDatX data aggregation, eLearn analysis platform, and in-vehicle network protocol stack. The eSync OTA platform is based on the eSync Alliance standard and enables connected cars, electric vehicles, and autonomous vehicles.

About Tessolve

Tessolve is a leading provider of system productization and chip design solutions, operating in 21 countries and regions in the United States, Europe and Asia Pacific. It has independent infrastructure and world-class laboratory facilities, and a global team of 3,000 engineers.

As an ODM, Tessolve focuses on the automotive, industrial and avionics market sectors, providing product development services from concept to manufacturing. The company accelerates product launch through plug-and-play system modules and application system solutions, as well as deep domain expertise, innovative ideas, process-oriented methods and mature ecosystem partnerships (including supply chain and product lifecycle post-management).

Tessolve also launched the groundbreaking automotive platform TERA as a white label product line. TERA includes service-oriented high-performance gateways, TCUs, regional and domain controller platforms, OBD dongles, and provides a unique customer experience through an enhanced software-defined automotive architecture, coupled with its partner Excelfore's FOTA services.

TERA is based on NXP's S32G automotive network processor and has edge computing capabilities.

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