Changdian Technology's High Reliability Automotive SiC Power Device Package Design

Changdian Technology has accumulated decades of technical experience in the field of power device packaging and has a comprehensive range of power product packaging appearances, covering the packaging and testing of popular products such as IGBT, SiC, and GaN.

Among them, in the field of automotive high-density power packaging and testing, Changdian Technology has achieved industry-leading power supply/main drive solutions based on differentiated power module technology.

For high power density silicon carbide (SiC) power modules, the innovative packaging technology used by Changdian Technology can significantly reduce parasitic effects and thermal resistance, and use advanced interconnect technology to provide strong packaging reliability, reduce power loss, and help customers improve product application performance.

The acceleration of automobile electrification and the rising prosperity of the new energy vehicle market have opened a window of growth for the automotive power semiconductor market. A large number of power devices are used in the motor control system, DC-DC conversion, electric air conditioning drive, OBC, and battery management of new energy vehicles.

According to statistics from Strategy Analytics and other institutions, the value of power devices in pure electric vehicles is about five times that of traditional fuel vehicles, which will bring significant growth in the power device market.

Silicon carbide power devices have lower on-resistance, higher voltage resistance, faster switching speed, and are capable of operating at high temperatures. They are beneficial for increasing the power density of the inverter, improving the vehicle's operating efficiency and mileage under actual operating conditions, and have broad market application prospects.

In order to ensure that silicon carbide (SiC) power modules can give full play to the above advantages under actual working conditions, Changdian Technology uses low stray inductance packaging technology, innovative material interconnect packaging technology and advanced thermal management technology, and combines the actual use needs of customers to provide all-silver sintering process, copper wire bonding, single-sided direct water cooling and other system integration solutions.

In addition, SiC power chips are small in size, high in voltage resistance, and high in power density. When used on the 800V platform of electric vehicles, they can produce higher system advantages and achieve the combined benefits of fast charging and long driving range. To this end, Changdian Technology has continuously optimized its packaging technology, achieved multiple iterations of HPD (Hybrid Package Driver) packaging, and innovatively launched a single-sided direct water cooling solution to meet the application requirements of silicon carbide devices such as low parasitic inductance and high switching speed.

With the accelerated application of silicon carbide devices in the fields of automotive controllers, charging piles, photovoltaic energy storage, etc., Changdian Technology has launched a series of package shapes that meet the needs of different users by combining innovative designs and platform development such as packaging materials, internal connections and packaging structures, such as:

400V platform A0/A00 vehicles with power less than 70KW: Si Hybrid Package 1 solution;

400V platform 100-200KW Class A cars: Si/SiC Hybrid Package Driver solution;

800V platform 200KW and above B-class and luxury cars: SiC single-sided/double-sided heat dissipation solution.

The market space for automotive power devices such as silicon carbide is broad, and the technological iteration is highly certain, creating good development opportunities for device designers and manufacturers with first-mover advantages. Changdian Technology will continue to focus on developing power device-related packaging solutions, providing customers with a wider range of technology options and helping customers apply more efficient and reliable technologies in new energy vehicle systems.