Glue solution for filling, reinforcing and protecting electronic components such as BGA chips in the automotive autonomous driving domain controller motherboard

In the future, driverless car technology will be increasingly used in transportation. As technology continues to advance and mature, driverless cars will become a part of everyone's daily life.

Self-driving cars can use sensors and advanced computer vision technology to avoid impacts and other dangerous situations. For some people who cannot drive a car, self-driving cars will become a more convenient and reliable mode of transportation. However, the popularity of self-driving cars will also bring some challenges. The technology of self-driving cars should be continuously updated and improved to ensure their safety and reliability. Hans New Materials has long entered the field of automotive electronics, and its independently developed and produced electronic glue can escort automotive electronics. The following explains the glue solution for filling, reinforcing and protecting electronic components such as PCB motherboard chips, BGA, etc. in the automotive autonomous driving domain (ADAS) controller.

Application Scenario

Automotive Autonomous Driving Domain Controller

Autonomous driving domain control (ADAS)/smart cockpit domain control and other products

Customer glue requirements

1. The BGA chip of the motherboard of the car's autonomous driving domain controller needs to be filled with glue for reinforcement and protection.

2. Encapsulation of solder joints of electronic components pins on the mainboard of the car’s autonomous driving domain controller.

3. Circuit board protection for automotive domain controller products

Glue testing requirements:

1. Benchmark against foreign brand - Moutai.

2. Temperature and humidity working environment reliability test

3. Automobile vibration test, simulating the various vibration environments that the product encounters during transportation, installation and use

Hans New Material Solution: HS710

Hans recommends customers to use HS506 conformal coating/conformal adhesive for circuit board protection.

Hans recommends customers to use Hans bottom filler HS710 for motherboard chip BGA filling and dispensing and electronic component pin solder joint encapsulation and dispensing protection. HS710 has the characteristics of low viscosity, fast flow speed, high TG, low CTE expansion coefficient, etc., and is suitable for BGA bottom filling of tiny gap chips.