This book comprehensively discusses signal integrity and power integrity issues. It mainly talks about the overview of signal and power integrity analysis and physical design, the essential meaning of four types of signal and power integrity problems, the impact of physical interconnect design on signal integrity, the characteristic analysis of capacitance, inductance, resistance and conductance, four practical technical approaches to solving signal and power integrity problems, the solutions hidden behind derivation and simulation, and recommended design guidelines for improving signal and power integrity. This book also discusses the application of S parameters in signal and power integrity, and gives a design example of a power distribution network. This book emphasizes intuitive understanding, practical tools and engineering literacy. The author points out the root causes of signal and power integrity problems from the perspective of a practical expert, and especially gives solutions to problems in the early design stage. Chapter 1 Signal Integrity Is in Your Future 1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility? 1.2 Signal-Integrity Effects on One Net 1.3 Cross Talk 1.4 Rail-Collapse Noise 1.5 ElectroMagnetic Interference (EMI) 1.6 Two Important Signal-Integrity Generalizations 1.7 Trends in Electronic Products 1.8 The Need for a New Design Method ology 1.9 A New Product Design Methodology 1.10 Simulations 1.11 Modeling and Models 1.12 Creating Circuit Models from Calculation 1.13 Three Types of Measurements 1.14 The Role of Measurements 1.15 The Bottom Line Chapter 2 Time and Frequency Domains 2.1 The Time Domain 2.2 Sine Waves in the Frequency Domain 2.3 Shorter Time to a Solution in the Frequency Domain 2.4 Sine -Wave Features 2.5 The Fourier Transform 2.6 The Spectrum of a Repetitive Signal 2.7 The Spectrum of an Ideal Square Wave 2.8 From the Frequency Domain to the Time Domain 2.9 Effect of Bandwidth on Rise Time 2.10 Bandwidth and Rise Time 2.11 What Does Significant Mean? 2.12 Bandwidth of Real Signals 2.13 Bandwidth and Clock Frequency 2.14 Bandwidth of a Measurement 2.15 Bandwidth of a Model 2.16 Bandwidth of an Interconnect 2.17 The Bottom Line Chapter 3 Impedance and Electrical Models 3.1 Describing Signal-Integrity Solutions in Terms of Impedance 3.2 What Is Impedance? 3.3 Real Versus Ideal Circuit Elements 3.4 Impedance of an Ideal Resistor in the Time Domain 3.5 Impedance of an I deal Capacitor in the Time Domain 3.6 Impedance of an Ideal Inductor in the Time Domain 3.7 Impedance in the Frequency Domain 3.8 Equivalent Electrical Circuit Models 3.9 Circuit Theory and SPICE 3.10 Introduction to Measurement-Based Modeling 3.11 The Bottom Line Chapter 4 The Physical Basis of Resistance 4.1 Translating Physical Design into Electrical Performance 4.2 The Only Good Approximation for the Resistance of Interconnects 4.3 Bulk Resistivity 4.4 Resistance per Leng th 4.5 Sheet Resistance 4.6 The Bottom Line Chapter 5 The Physical Basis of Capacitance 5.1 Current Flow in Capacitors 5.2 The Capacitance of a Sphere 5.3 Parallel Plate Approximation 5.4 Dielectric Constant 5.5 Power and Ground Planes and Decoupling Capacitance 5.6 Capacitance per Length 5.7 2D Field Solvers 5.8 Effective Dielectric Constant 5.9 The Bottom Line Chapter 6 The Physical Basis of Inductance 6.1 What Is Inductance? 6.2 Inductance Principle 1: There Are Circular Rings of Magnetic-Field Lines Around All Currents 6.3 Inductance Principle 2: Inductance Is the Number of Webers of Field Line Rings Around a Conductor per Amp of Current Through It 6.4 Self-Inductance and Mutual Inductance 6.5 Inductance Principle 3 : When the Number of Field Line Rings Around a Conductor Changes,There Will Be a Voltage Induced Across the Ends of the Conductor 6.6 Partial Inductance 6.7 Effective, Total, or Net Inductance and Ground Bounce 6.8 Loop Self- and Mutual Inductance 6.9 The Power Distribution Network (PDN) and Loop Inductance 6.10 Loop Inductance per Square of Planes 6.11 Loop Inductance of Planes and Via Contacts 6.12 Loop Inductance of Planes with a Field of Clearance Holes 6.13 Loop Mutual Inductance 6.14 Equivalent Inductance of Multiple Inductors 6.15 Summary of Inductance 6.16 Current Distributions and Skin Depth 6.17 High-Permeability Materials 6.18 Eddy Currents 6.19 The Bottom Line Chapter 7 The Physical Basis of Transmission Lines 7.1 Forget the Word Ground 7.2 The Signal 7.3 Uniform Transmission Lines 7.4 The Speed of Electrons in Copper 7.5 The Speed of a Signal in a Transmission Line 7.6 Spatial Extent of the Leading Edge 7.7 “Be the Signal” 7.8 The Instantaneous Impedance of a Transmission Line 7.9 Characteristic Impedance and Controlled Impedance 7.10 Famous Characteristic Impedances 7.11 The Impedance of a Transmission Line 7.12 Driving a Transmission Line 7.13 Return Paths 7.14 When Return Paths Switch Reference Planes 7.15 A First-Order Model of a Transmission Line 7.16 Calculating Characteristic Impedance with Approximations 7.17 Calculating the Characteristic Impedance with a 2D Field Solver 7.18 An n-Section Lumped-Circuit Model 7.19 Frequency Variation of the Characteristic Impedance 7.20 The Bottom Line Chapter 8 Transmission Lines and Reflections 8.1 Reflections at Impedance Changes 8.2 Why Are There Reflections? 8.3 Reflections from Resistive Loads 8.4 Source Impedance 8.5 Bounce Diagrams 8.6 Simulating Reflected Waveforms 8.7 Measuring Reflections with a TDR 8.8 Transmission Lines and Unintentional Discontinuities 8.9 When to Terminate 8.10 The Most Common Termination Strategy for Point-to-Point Topology 8.11 Reflections from Short Series Transmission Lines 8.12 Reflections from Short-Stub Transmission Lines 8.13 Reflections from Capacitive End Terminations 8.14 Reflections from Capacitive Loads in the Middle of a Trace 8.15 Capacitive Delay Adders 8.16 Effects of Corners and Vias 8.17 Loaded Lines 8.18 Reflections from Inductive Discontinuities 8.19 Compensation 8.20 The Bottom Line Chapter 9 Lossy Lines, Rise-Time Degradation, and Material Properties 9.1 Why Worry About Lossy Lines? 9.2 Losses in Transmission Lines 9.3 Sources of Loss: Conductor Resistance and Skin Depth 9.4 Sources of Loss : The Dielectric 9.5 Dissipation Factor 9.6 The Real Meaning of Dissipation Factor 9.7 Modeling Lossy Transmission Lines 9.8 Characteristic Impedance of a Lossy Transmission Line 9.9 Signal Velocity in a Lossy Transmission Line 9.10 Attenuation and dB 9.11 Attenuation in Lossy Lines 9.12 Measured Properties of a Lossy Line in the Frequency Domain 9.13 The Bandwidth of an Interconnect 9.14 Time-Domain Behavior of Lossy Lines 9.15 Improving the Eye Diagram of a Transmission Line 9.16 How Much Attenuation Is Too Much? 9.17 The Bottom Line Chapter 10 Cross Talk in Transmission Lines 10.1 Superposition 10.2 Origin of Coupling: Capacitance and Inductance 10.3 Cross Talk in Transmission Lines: NEXT and FEXT 10.4 Describing Cross Talk 10.5 The SPICE Capacitance Matrix 10.6 The Maxwell Capacitance Matrix and 2D Field Solvers 10.7 The Inductance Matrix 10.8 Cross Talk in Uniform Transmission Lines and Saturation Length 10.9 Capacitively Coupled Currents 10.10 Inductively Coupled Currents 10.11 Near-End Cross Talk 10.12 Far-End Cross Talk 10.13 Decreasing Far-End Cross Talk 10.14 Simulating Cross Talk 10.15 Guard Traces 10.16 Cross Talk and Dielectric Constant 10.17 Cross Talk and Timing 10.18 Switching Noise 10.19 Summary of Reducing Cross Talk 10.20 The Bottom Line Chapter 11 Differential Pairs and Differential Impedance 11.1 Differential Signaling 11.2 A Differential Pair 11.3 Differential Impedance with No Coupling 11.4 The Impact from Coupling 11.5 Calculating Differential Impedance 11.6 The Return-Current Distribution in a Differential Pair 11.7 Odd and Even Modes 11.8 Differential Impedance and Odd-Mode Impedance 11.9 Common Impedance and Even-Mode Impedance 11.10 Differential and Common Signals and Odd- and Even-Mode Voltage Components 11.11 Velocity of Each Mode and Far-End Cross Talk 11.12 Ideal Coupled Transmission-Line Model or an Ideal Differential Pair 11.13 Measuring Even- and Odd-Mode Im
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