Driven by intelligence and electrification, automotive MOSFET has great potential

Super junction MOSFET is a new device type in the powertrain after the electrification of automobiles, and is mainly used in DC-DC power supplies and on-board chargers (OBC). In the powertrain, after the electrification of automobiles, electric braking is used to increase the power of power-related power supplies such as DC-DC, on-board chargers and inverters. Super junction MOSFET, IGBT, SiC MOSFET devices and modules suitable for medium, high voltage and high current are needed to complete the efficient conversion of electric energy. Taking the automotive MOSFET application reference provided by China Resources Microelectronics as an example, 16 super junction MOSFETs need to be added to the on-board charger part of new energy vehicles.

Super junction MOSFETs above 650V are widely used in new energy vehicle OBC and HV-LV DC-DC. In new energy vehicles, the on-board charger OBC mainly uses the power provided by the AC grid to charge the high-voltage power battery, and the HV LV DC-DC power converter connects the high-voltage area and low-voltage area of ​​the car together. According to the power level of the car and the size of the battery, the corresponding voltage of the OBCDC-DC power supply device is roughly divided into 650V and 1200V.

Super junction MOSFET is the best choice for mainstream medium and low voltage OBC and DC-DC power solutions considering performance, cost and efficiency. Super junction MOSFET has excellent conductivity, switching and driving loss performance and can meet the requirements of most medium voltage (600-650V) power products in automobiles; due to its mature technology and the largest product portfolio, it is the most cost-effective choice. Therefore, MOSFET is widely used in mainstream medium and low power (6.6KW11KW) OBC and HV LV DC-DC converters (automotive high voltage batteries below 500V).

MOSFET main drive solutions are widely used in A00-class vehicles below 30KW. The motor controller of pure electric A00-class vehicles with a main drive power range of 20-30kW has similar power device requirements to the on-board charger, and MOSFET is selected as a low-cost solution. At present, the penetration rate of MOSFET main drive solutions in my country's new energy passenger car market is nearly 15%, and the representative brands are BAIC Manufacturing, Changhe, Chery, Wuling, Xiaohu, Lingbao, Xinte, Haima, Zhidou, Reading, Dongfeng Fengguang, Roewe, Lingtu, Dongfeng Fengshen, Zotye, Punk, Baojun, Sihao, etc.

The intelligentization and electrification of automobiles drive the growth of the MOSFET market. The global MOSFET device market will increase to US$8.9 billion in 26 years, of which automotive applications account for 30%; the global automotive power device market will increase to US$10.8 billion, with MOSFET accounting for about 25%. Combining Omdia and Yole data, we expect the global MOSFET market to increase from US$7.4 billion to US$8.9 billion from 2020 to 2026. Benefiting from the intelligentization and electrification of automobiles, the proportion of automotive applications will increase from 25% to 30%. From 2020 to 2026, the global automotive (including fuel vehicles) power device market will increase from US$4.8 billion to US$10.8 billion, of which the automotive MOSFET single tube and module market will increase from US$1.83 billion to US$2.67 billion. IGBT, SiC and other devices are mainly used in new energy vehicles, with a relatively fast growth rate.

The average MOSFET usage in automobiles will increase to more than 135, with the ADAS and non-fuel vehicle powertrain markets growing fastest. Benefiting from the intelligentization of automobiles, the MOSFET non-power application market will increase from US$830 million to US$1.11 billion from 2020 to 2026, of which ADAS will increase from US$0.3 to US$0.9 billion driven by the intelligent upgrade of safety management, domain control systems, and parking systems; benefiting from the electrification of automobiles, the non-fuel vehicle powertrain market including mild hybrids will increase from US$150 million to US$600 million.

DJI drone disassembly: Some American components are still irreplaceable

The Nikkei Asian Review recently teamed up with Tokyo-based research company Fomalhaut Techno Solutions to disassemble and analyze the Mavic Air 2 launched by DJI earlier this year, and found that 80% of its parts are purchased materials and their value is only about 20% of the selling price.

▍Cost control is much better than that of Japanese companies. After disassembling the DJI Mavic Air 2, it was found that the estimated cost of the parts was $135. The cost rate is only 20%, which is lower than the 30-35% of smartphones. An executive of a Japanese company said, "To achieve the same performance, the material cost of Japanese companies alone will be twice the price of the whole machine." It can be seen that low cost has become the source of DJI's competitiveness. They also found that many parts of the Mavic Air 2 are also often found in smartphones and computers, and these parts account for 80% of the 230 parts used in Air2, including camera parts used in high-end mobile phones and GPS receivers used in smart watches.

▍High technical strength Of course, it is not limited to low cost. The Mavic Air 2, which is the subject of the survey, can shoot 4K quality images when used for aerial photography, and also has functions such as automatic tracking and obstacle avoidance. In Japan, it can be controlled from up to 6 kilometers away, and the distance of wireless image transmission is about 5 times that of other companies' products. In order to achieve the light weight of 570 grams, a design similar to electronic equipment is adopted. The main substrate is about 10 cm × 4 cm in size, and 10 semiconductor components of various sizes, such as control and communication semiconductors and sensors, are installed at a high density on one substrate. The software technology is also strong. DJI continues to explore and improve its software by actively launching new products. A Japanese drone developer praised that "the flight control was not mature at first, but after about 3 years, it feels impressive." According to a survey by Patent Result, a Japanese company involved in patent analysis, DJI has 185 valid patents in Japan (as of January 2019), which is more than three times the number of the second place. This also proves its high technical strength. ▍The chip that controls the propellers is the only proprietary component Fomalhaut officials said: "The chip that controls the propellers is the only proprietary technology component." In addition, expensive parts that cost more than $10 are limited to batteries, cameras, and some other parts. However, the editor believes that the technology that can perfectly integrate these parts and design humanized software control is the most valuable development cost.

▍American parts cannot be replaced for the time being In addition to the above, this disassembly also shows that Mavic Air 2 uses many American-made parts, such as the IC chip that controls the battery is made by Texas Instruments, and the IC chip that amplifies radio signals and eliminates noise is made by Qorvo. These parts are considered difficult to replace at present. If they become the new target of the United States, DJI's parts procurement may be affected.

According to a survey by the US research firm Frost & Sullivan, the world's commercial drone market will rapidly expand from US$3.7 billion in 2018 to US$103.7 billion by 2023, and China will account for half of it.

▍Mavic Air 2 main components description Main IC on the front of the main control board

1.Ambarella-H6-image processor solution chip 2.SK Hynix-H9HCNNN8KUML-LPDDR4 memory chip 3.Samsung-KLMAG1JETD-flash memory chip 4.DJI-S1-information synchronization transmission chip 5.TI-OPT3101-obstacle avoidance sensor front-end module Main IC on the back of the motherboard

1.Active-Semi-ACT8846-Power management chip 2.ImaginationTechnologies-IMG IE1000-Dual-band WIFI solution chip GPS module mainboard front IC

1. STMicroelectronics - Six-axis accelerometer and gyroscope chip GPS module back side IC

1.ublox- M8030-KT-GNSS satellite positioning solution chip 2.iSentek- IST8310-electronic compass chip IC on the back of the power supply motherboard

1. Active-Semi- PAC5223- Flight propeller motor driver chip (4 chips) 2. ALPHA & OMEGA- AON7934- Asymmetric n-channel AlphaMOS chip (12 chips in total)