According to the latest data from AutoForecast Solutions (AFS), an automotive industry data forecasting company, as of October 30, due to chip shortages, the global auto market has reduced production of approximately 3.905 million vehicles this year. Although the overall chip shortage has been alleviated, local and individual chip shortages still exist, and structural core shortages still exist. Coupled with the impact of the epidemic and other factors, the production capacity of individual automobile manufacturers is still limited.
In addition, the popularity of automobile electrification and intelligence is accelerating, and many new car-making forces are advancing. The demand for automobile chips has not decreased. Smart cockpits, autonomous driving, and Internet of Vehicles have begun to be launched on a large scale, and one-core multiple screens have attracted more attention.
The acceleration of automobile intelligence has made smart cockpits more and more technologically advanced, with more and more cool functions being integrated into them. Moreover, the trend of "one core, multiple screens", multi-screen integration and multi-screen interaction is becoming more and more obvious. Various human-computer interactions such as gestures, voice, and touch are beginning to be widely used in automotive electronics. Many chip manufacturers have launched "one core, multiple screens" solutions.
Xinchi X9 series chips
Xinchi Intelligent Cockpit X9 series chips are car-grade automotive chips specially designed for the new generation of automotive electronic cockpits. They integrate high-performance CPU, GPU, AI accelerator, and video processor to meet the powerful requirements of new generation automotive electronic cockpit applications. Increasing demands for computing power, rich multimedia capabilities, and more. In addition, the X9 series chips also integrate PCIe3.0, USB3.0, Gigabit Ethernet, and CAN-FD, which can be seamlessly applied to vehicle-mounted systems at a lower cost. This chip also uses a safety island including Cotex-R5 dual-core lockstep mode, which can be used in scenarios with strict safety performance requirements.
Renesas H3 solution
Renesas H3 is a 16nm process automotive SoC based on A57/A53. It adopts ARM's 64-bit CPU core architecture and can achieve a processing performance of 40,000 DMIPS. Using GX6650 as the 3D graphics engine can provide drivers with timely and reliable information display. Based on the latest architecture provided by Imagination Technologies, H3’s shading calculation performance is approximately three times that of H2.
Qualcomm SA8155P solution
Qualcomm SA8155P is manufactured using a 7-nanometer process and has eight cores with a computing power of 8TOPS. It can support up to 6 cameras and can connect four 2K screens or three 4K screens. Qualcomm SA8155P smart cockpit is equipped with a personalized computer vision and machine learning computer application platform, including AI accelerators. At the same time, Qualcomm has also integrated advanced Wi-Fi and Bluetooth technologies on the SoC, which can support the latest Wi-Fi 6 and Bluetooth 5.1 technologies.
Rockchip RK3588M solution
Rockchip RK3588M one-core multi-screen smart cockpit solution uses one RK3588M chip to drive 5 screens at the same time, including 1 2K resolution central control screen, 2 1024*600 resolution electronic rearview mirrors, and 2 2K resolution Rate rear headrest screen.
Rockchip RK3588M adopts 8nm process, has nearly 100K DMIPS computing power, quad-core Mali-G610 MP4 GPU, 6TOPS NPU, built-in self-developed dual-channel 16 million pixel processing capacity ISP + 8K video encoding and decoding capabilities, displayed on the screen , image processing, and video processing all have strong performance.
C4-Alfus jointly developed by Intel and Neusoft
The C4-Alfus system can support virtualization and seamlessly support the use and interaction of multiple high-definition screens such as in-vehicle infotainment systems, digital instruments, and in-car navigation systems.
In addition, domestic manufacturers such as Cambrian, Quanzhi Technology, Amlogic Technology, and Richhan Micro are accelerating the deployment of automotive smart cockpit chips.
Nowadays, electronic equipment such as in-car entertainment systems, digital LCD instruments, head-up displays (HUD), streaming rearview mirrors, and rear displays have become the basic configuration of most OEMs’ smart cockpit solutions. "One core, multiple screens", the solution is attracting more and more attention. The "one-core, multiple-screen" solution, in which a single SoC chip runs multiple operating systems and simultaneously drives multiple displays for integration and interaction, has become the development trend of smart cockpits.
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