The annual semiconductor event SEMICON China 2020 came to a close at the Shanghai New International Expo Center.
JRS Booth E6471
As the first exhibition of the semiconductor industry in 2020 , SEMICON brought together the global semiconductor industry to participate in the exhibition. As a mainstream manufacturer of semiconductor packaging and testing equipment, the booth of JRS was crowded with people, and it was one of the focuses of the semiconductor equipment pavilion.
R&D and technical colleagues listened carefully to visitors' questions and answered them one by one
At this exhibition, JRS exhibited an integrated turntable test platform application device - the 320X all-in-one test and programming machine and a visual inspection device V1000 that can perform both die bonding and wire bonding visual inspection. Once these two devices were unveiled, they attracted great attention from well-known experts, scholars and entrepreneurs on site, including many of the world's leading packaging and testing manufacturers. At the same time, there were also on-site customers asking whether kits could be customized during the chip production process, and whether the 320X device was suitable for ultra-small chips such as QFN 0603. JRS's 320X all-in-one test and programming machine not only supports kit customization, but also has a sprint speed of 55K, and can quickly and flexibly replace kits within 4 hours; in the next one to two years, JRS's 320X can be perfectly applied to the field of ultra-small chip inspection such as QFN 0603.
SEMICON China 2020
Although the COVID-19 pandemic has disrupted the rhythm of the semiconductor industry, and the overall semiconductor industry sales are expected to have a negative growth of 5% or more, SEMI predicts that 2021 will be a landmark year for global wafer fab equipment spending, with a growth rate of 24% to a record $67.7 billion, and all product areas are expected to achieve stable growth. At this critical moment, Suzhou Jieruis Intelligent Technology Co., Ltd. continues to increase its R&D investment in semiconductor packaging and testing equipment, and actively launches testing equipment solutions for the back-end of semiconductor chip packaging and testing, striving to solve difficult problems for packaging and testing manufacturers in times of crisis, helping customers reduce costs and increase efficiency, and helping the semiconductor industry recover.
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