FLIR Thermal Imaging Cameras: Solar Inverter Circuit Board Inspection

The faults of electronic circuits are generally divided into short circuit, open circuit and poor contact. The infrared rays emitted by electronic components are different when the circuit is working normally and when it is faulty. That is to say, the thermal imaging of the circuit board when the circuit is working normally is very different from the thermal imaging of the faulty circuit board.

When an electronic component fails, there are two situations: one is a short circuit. When a short circuit occurs, the current is large, the component is hot, and its infrared radiation is large. At this time, the thermal imaging is very different from the normal infrared imaging; the other is when the component is open (poor contact), the current flowing through the component is almost zero, so the component temperature is lower than when it is working normally, and there is almost no infrared radiation. At this time, the thermal imaging is very different from the normal thermal imaging. Using this principle, it is easy to determine the fault point of the electronic circuit.

Infrared thermal imaging provides a unique IC testing method for testers. Through a single infrared scanning imaging, the power consumption value of each IC on the board can be obtained and converted into visual information for testers to perform fault diagnosis.

Thermal imagers can provide clear images of the circuit board's temperature field distribution and accurate temperature measurement.

The devices on the same circuit board should be arranged in zones according to their heat generation and heat dissipation as much as possible. A reasonable arrangement of devices can effectively reduce the temperature rise of the printed circuit, thereby significantly reducing the failure rate of devices and equipment.

Thermal imagers can help engineers analyze the temperature distribution of the entire circuit board by providing infrared heat maps, thereby improving engineers' designs and applications.

The stability and aging rate of electronic components are closely related to the ambient temperature. Whenever the ambient temperature rises by 10°C, the life of the main power components decreases by 50%, which requires that electronic components should work in a relatively stable and low temperature range. Thermal imagers can provide engineers with heat maps of the heating conditions of various components in the circuit during operation, helping engineers analyze the impact of components on the temperature of the entire circuit, and also helping engineers select conversion modules with appropriate load capacity.