The technological achievements of solar-grade monocrystalline silicon wafer cutting process have reached the domestic advanced level

Recently, the Qinghai Provincial Science and Technology Department organized relevant experts to evaluate the results of the "Solar Grade 125×125 Monocrystalline Silicon Wafer Cutting Technology Research" project. The experts attending the meeting unanimously agreed that the research results have reached the domestic advanced level.

This process improves the existing multi-wire cutting and silicon wafer cleaning processes, and adopts technologies such as guide ceramic strip positioning and variable slot pitch cutting to optimize the production process, thereby increasing the product yield from 70% to over 90%, and the single-cutting product rate to over 97%, enhancing the company's independent innovation capabilities and product market competitiveness.

Through the implementation of the project, the company standard for solar-grade monocrystalline silicon wafer testing was formulated, and the Qinghai provincial local standard "Solar-grade monocrystalline silicon wafer quality requirements" was compiled. The expert committee recommended that the company implement intellectual property protection for its independent innovation technology as soon as possible.