Agile innovation, accelerated growth! 2022 Tech Cloud Innovation Forum is waiting for you

Beijing, China, June 17, 2022 - [2022 Tektronix Cloud Innovation Forum] will be held on June 29-30, 2022. The forum focuses on hot topics such as third-generation semiconductors, chip manufacturing, basic material research, high-performance computing, power supply testing, smart cars, 6G, etc. It is aimed at personnel from educational and scientific research institutions, R&D and hardware engineers from various industries, and will help break through the technical bottlenecks of basic disciplines, build a strong technology engine, and drive the industrial upgrading of the whole society. At that time, experts from various fields at home and abroad will share the latest development trends and cutting-edge testing solutions in the industry. Scan the QR code to participate, 5 popular topics, 40+ top experts at home and abroad, and 30+ technical sharing courses to be unlocked!

Accelerate testing and digitize testing

In the digital age, test and measurement must also keep pace with the times. This thematic course covers basic test methods, the application of test software and tools, and the establishment and practice of a modern engineering education system, helping you to cope with general testing in a more efficient way.

In this session, we will bring you technical sharing courses:

- Application of the new 2 series oscilloscope in the field of education

- The establishment and practice of practical teaching system of higher education engineering driven by industrial demand

- Introduction to Python Instrument Automation

- Remote collaboration using test and measurement software tools

- …

Testing and Application of Wide Bandgap Semiconductors

The third-generation semiconductors represented by SiC and GaN bring more testing and application challenges to customers. Tektronix helps customers quickly evaluate device performance during R&D design, failure analysis, factory inspection and trial production, respond to market demand more quickly to improve product performance, and also helps customers quickly verify self-developed drive circuits and accelerate the implementation of application-side solutions.

In this session, we will bring you technical sharing courses:

- Domestic leading third-generation semiconductor experts share the development and application of SiC and GaN

- Third generation semiconductor wafer level packaging test

- Double pulse test solution for wide bandgap semiconductor power devices

- ...

Software-defined automotive E/E architecture and the evolution of the three-electric system

Tektronix is ​​committed to becoming a leader in smart car testing, walking at the forefront of industry development trends, focusing on smart cockpits, autonomous driving and automotive three-electric fields, continuously investing and focusing on important test points of smart car testing, and providing customers with safe, reliable and efficient smart travel testing solutions.

In this session, we will bring you technical sharing courses:

- Sharing on the super-fast charging technology and standardization process in the electric vehicle industry

- High-speed signal testing of Xinchi high-performance automotive processor

- How to cope with new DDR5 testing challenges

- Uncovering the mystery of the challenges of integrated design of communications, radar and perception

- ...

Assisting the technological innovation of third-generation semiconductors in the power industry

The third generation of semiconductors SiC & GaN has brought disruptive technological innovation to the power industry, but also brought new debugging and verification challenges to power design engineers.

In this session, we will bring you technical sharing courses:

- Power Electronics Market Trends

- Application of energy storage technology in photovoltaic industry

- Accurate testing helps solve the development and testing problems of SiC and GaN power supplies

- How to optimize power converter and power supply design?

- ...

Cutting-edge technology exploration and breakthroughs

Cutting-edge scientific research service areas include the measurement of tiny signals of neural network chips, future communications, real-time analysis and cross-domain coordination of complex RF signals, and testing and verification of various latest high-speed bus signals.

In this session, we will bring you technical sharing courses:

- Optical neuromorphic brain computing test

- 6G: The future of communications

- Application of real-time oscilloscope in 50G PON research

- Validate SerDes supporting PCI Express 6.0 PAM4

- How to get deeper insight into your signals: Cross-domain signal measurement and analysis