SmartSens launches two new mobile phone application products based on its self-developed advanced BSI process platform

SmartSens launches two new mobile phone application products SC520CS and SC820CS based on its self-developed advanced BSI process platform

July 27, 2022, Shanghai, China - SmartSens (Shanghai) Electronic Technology Co., Ltd. officially launched the Cellphone Sensor (CS) Series mobile phone application image sensor products SC520CS and SC820CS. Both new products are built with 12-inch wafer process, equipped with SmartSens' innovative SFCPixel® patented technology and ultra-low noise peripheral readout circuit technology. As the first batch of products put into mass production on SmartSens' self-developed advanced BSI process platform, through the three key process technologies of wafer bonding technology, wafer thinning technology and silicon surface passivation technology of this platform, they can provide excellent imaging performance for the current smartphone front camera, rear main camera and rear auxiliary camera applications.

Smartphones are currently the largest application market for CIS products, and their imaging systems are constantly undergoing strong upgrades. According to Counterpoint Research, the average CMOS image sensor (CIS) content of each smartphone will expand to 4.1 in the future. At the same time, the combined effect of more powerful chipsets, breakthroughs in imaging performance, and advances in software and hardware will continue to provide consumers in the mobile phone market with a better imaging experience.

Innovative imaging technology and 12-inch wafer process achieve excellent imaging quality

Both new mobile phone applications released this time are equipped with SmartSens' innovative SFCPixel® patented technology. The sensitivity of SC520CS and SC820CS can reach 840mV/lux•s, allowing mobile phone cameras to have excellent night vision imaging performance even in low-light shooting environments. At the same time, thanks to the support of SmartSens' ultra-low noise peripheral read circuit technology, both new products have excellent noise control performance. Taking SC820CS as an example, compared with products of the same specifications in the industry, its read noise (RN) and fixed noise (FPN) are greatly reduced by 25% and 81% respectively, which can bring excellent night shooting imaging effects to mobile phone cameras. In terms of color rendering, the Chroma high and low color temperatures of SC820CS are relatively improved by 13% and 22% respectively, making the image more vivid and the colors more realistic.

In addition, both new products are built using 12-inch wafer technology, which greatly guarantees the high yield of wafer chip output by increasing both area and chip utilization. In view of the defects that are easy to occur during the processing process, products using 12-inch wafers have better reliability, and can maintain excellent imaging performance even when used for a long time in harsh environments such as high temperature and high humidity; on the other hand, thanks to the support of more cutting-edge process technology, 12-inch wafers can ensure the consistency of CIS product performance everywhere on the entire wafer to the greatest extent.

Self-developed advanced BSI process platform product debuts three major process technologies to create excellent imaging quality

Compared with the traditional front-illuminated FSI, the back-illuminated BSI has better photosensitivity, but because it is a highly customized technology, it has great technical difficulty in chip design and process. The SC520CS and SC820CS launched this time are the first batch of new products put into mass production based on SmartSens' domestically developed advanced BSI process platform. Through three key process technologies, including wafer bonding technology, wafer thinning technology, and silicon surface passivation technology, the platform enables the product to have excellent dark light imaging quality, which helps meet the high-quality demand for smartphone imaging.

Mr. Ouyang Jian, Deputy General Manager of SmartSens, said: "The mobile CIS field is constantly undergoing product iterations and performance upgrades. We must be innovative and enterprising to better meet the dual growth needs of customers and the market. SmartSens' two new mobile application products, SC520CS and SC820CS, are the first products of our self-developed advanced BSI process platform. They are built using 12-inch wafer technology. The three key process technologies on this platform effectively improve the product's sensitivity and noise control performance. At the same time, with the support of SmartSens' many cutting-edge imaging technologies, SC520CS and SC820CS have excellent low-light imaging quality, which can provide a high-quality video imaging experience for smartphone cameras."

The two new products have entered mass production in July 2022.