Recently, pmdtechnologies announced the launch of its next-generation 3D time-of-flight development kit "flexx2".
pmdtechnologies has partnered with Emcraft Systems, a California-based provider of hardware and software solutions for embedded applications, to launch the flexx2, an upgraded version of the PicoFlexx, to provide better depth perception performance, with 38,000 3D pixels and a 56 x 44° FOV, in a size comparable to a pack of gum, 72.1 mm x 19.2 mm x 10.2 mm.
The wavelength of the VCSEL emitter has been upgraded from 850 nm to 940 nm to further improve sunlight stability and outdoor performance. In addition, the USB-A port has been replaced with the more powerful USB 3.0 Type C.
Several new built-in user modes enable accurate measurement from as close as 10 cm to as far as 4 meters in a single frame rate. FlexX2 can run up to 60 frames per second, which is useful for algorithms that require fast capture, such as gesture control.
flexx2 comes with pmdtechnologies’ leading software development kit (SDK) “Royale” and will be code-compatible with previous PicoFlexx. Royale supports popular programming extensions including Matlab, OpenCV and ROS 1+2.
“Flexx2 builds on the success of the now discontinued ‘PicoFlexx’, which has brought pmdtechnologies’ 3D depth sensing technology to thousands of developers around the world,” said Mitchell Reifel, Vice President of pmdtechnologies. “The new program builds on the flexibility and reliability of the 3D Development Kit and leverages the high-quality depth data from the Infineon IRS2381C REAL3 Time-of-Flight image sensor and pmdtechnologies’ powerful SDK.”
As an additional flexibility option, flexx2 is available in two versions: as a packaged, post-qualified kit for prototyping and development, and as a non-packaged OEM module for volume production.
Pricing starts at $399/€355 for one unit. Prices drop for quantities of 20 or more.
In June 2021, Infineon announced that it and its time-of-flight (ToF) partner pmdtechnologies, together with industry-leading vision-based imaging expert ArcSoft, are developing a one-stop solution for smartphone under-screen ToF cameras. The solution will provide accurate and reliable infrared images and 3D data for applications with extremely high security requirements, such as face recognition and mobile payments.
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