Qualcomm releases first-generation Snapdragon AR2 platform, aiming to revolutionize AR glasses

Publisher:EE小广播Latest update time:2022-11-17 Source: EEWORLDKeywords:Qualcomm Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

The company launched the first platform specifically designed for head-mounted AR devices - the first-generation Snapdragon® AR2 platform, further expanding its XR product portfolio.

The platform adopts a groundbreaking multi-chip architecture, which reduces power consumption by 50% and improves AI performance by 2.5 times, enabling small, thin and high-performance AR glasses.

Several OEMs have entered different stages of product development using Snapdragon AR2, including Lenovo, LG, Nreal, OPPO, Pico, QONOQ, Rokid, Sharp, TCL, Vuzix and Xiaomi.


November 16, 2022, Hawaii - During the 2022 Snapdragon Summit, Qualcomm Technologies launched the first-generation Snapdragon AR2 platform, which provides groundbreaking AR technology and will help create a new generation of powerful, thin and light AR smart glasses. The new Snapdragon AR2 platform was designed from the beginning to revolutionize the design of head-mounted glasses and create a new era of spatial computing experience that integrates the real world and the metaverse.


Designed for AR: To create ultra-thin, high-performance AR glasses, the company uses a multi-chip distributed processing architecture combined with customized IP modules. The PCB area of ​​the main processor of the Snapdragon AR2 platform in AR glasses is reduced by 40%, the overall AI performance of the platform is improved by 2.5 times, and the power consumption is reduced by 50%, which can support AR glasses to achieve power consumption of less than 1W. This will support the creation of a richer experience on AR glasses and longer-term comfortable wearing, meeting the needs of consumer-level and enterprise-level use scenarios.


 image.png


AR distributed processing architecture: In order to achieve a more even weight and reduce the width of the left and right temples, the Snapdragon AR2 platform adopts a multi-chip architecture, including an AR processor, AR co-processor and connection platform. Snapdragon AR2 can dynamically allocate delay-sensitive sensing data processing directly to glasses terminals, offloading more complex data processing requirements to smartphones, PCs or other compatible host terminals equipped with the Snapdragon platform.


 image.png


The AR processor is optimized for low latency motion-to-display (M2P) and supports up to nine parallel cameras for user and environment understanding. Its enhanced perception capabilities include a dedicated hardware acceleration engine that can improve user motion tracking and positioning, an AI accelerator that reduces the latency of high-precision input interactions such as hand tracking or six degrees of freedom (6DoF), and a heavy-duty processor that supports a smoother visual experience. Projection engine.


The AR coprocessor aggregates camera and sensor data and supports eye tracking and iris authentication for visually focused rendering, optimizing workloads for only what the user is looking at to help reduce power consumption.


The connection platform uses Qualcomm FastConnect™ 7800 connection system to enable extremely fast commercial Wi-Fi 7 connections, making the latency between AR glasses and smartphones or host terminals less than 2 milliseconds. Integrated support for FastConnect XR Software Suite 2.0 enables better control of XR data to improve latency, reduce jitter and avoid unnecessary interference.


AR Ecosystem: In addition to the transformative Snapdragon AR2 technology, building an end-to-end solution that encompasses hardware, a full suite of sensing technologies, and software tools is critical to creating immersive experiences. To allow developers to create outstanding head-mounted AR applications, the Snapdragon AR2 platform and the second-generation Snapdragon® 8 mobile platform are now optimized to support Snapdragon Spaces. The Snapdragon Spaces™ XR developer platform is designed to pave the way for developers to reinvent head-mounted AR content and help drive the entire AR glasses market segment.


 image.png


Hugo Swart , vice president and general manager of Qualcomm Technologies' In its thin and stylish design, as differentiated demands for VR, MR and AR device technology and appearance continue to emerge, Snapdragon AR2 will become another masterpiece in our XR product portfolio that defines the metaverse experience, helping OEM partners. Revolutionizing AR Glasses.”


Rubén Caballero, corporate vice president of MR, devices and technology at Microsoft, said: "Microsoft and Qualcomm are working closely on the needs of the Snapdragon AR2 platform to help create dedicated basic technologies to unlock new possibilities for AR experiences. The innovative features of the Snapdragon AR2 platform will Transforming head-mounted AR devices and transforming immersive production work and collaboration. We are excited about the innovative technologies coming from Qualcomm and its partners.”


For more information, please visit the first-generation Snapdragon AR2 product webpage. To view the live replay, please visit the Snapdragon Summit page.


Keywords:Qualcomm Reference address:Qualcomm releases first-generation Snapdragon AR2 platform, aiming to revolutionize AR glasses

Previous article:Deeply cultivate data accuracy and algorithm effectiveness to meet the new generation of wearable technology trends
Next article:Molex "Wearable Diagnostic Devices: A Global Survey on the Future of Medical Monitoring"

Recommended ReadingLatest update time:2024-11-16 11:33

Qualcomm Snapdragon 735 specifications revealed: 7nm process + integrated 5G baseband
       Qualcomm released the Snapdragon 730 and 730G processors in April this year, and information about its next-generation products has now been exposed.   According to foreign media reports, the next generation of Snapdragon 730 will be named Snapdragon 735, and the biggest improvement is that it will be manufac
[Mobile phone portable]
[Tektronix Application Sharing] Three things to consider when synchronizing oscilloscopes for higher channel counts
When building a test system, you may need to measure multiple signals, and it may not be possible to fully capture them all with just the available channels of an oscilloscope. To increase the number of oscilloscope channels in a test system, a common approach is to group multiple oscilloscopes together. Multichannel
[Test Measurement]
[Tektronix Application Sharing] Three things to consider when synchronizing oscilloscopes for higher channel counts
Qualcomm releases four chips: Snapdragon 695, 778G+, 480+, and 680 4G
According to The Verge, Qualcomm has released a series of new Snapdragon chips for its mid-range and entry-level product series: Snapdragon 778 Plus, 695, 680 and 480 Plus. The most notable new chip is the Snapdragon 695, which replaces the Snapdragon 690 in Qualcomm's lineup. Unlike the older model, the Snapdragon
[Mobile phone portable]
Qualcomm releases four chips: Snapdragon 695, 778G+, 480+, and 680 4G
The advent of a new high-throughput combination 3D printing method may change the "rules of the game" for the discovery and manufacturing of new materials
Scientists from the University of Notre Dame in the United States have invented a new 3D printing method - high-throughput combined printing, which can control the 3D structure and local composition of materials and print materials with gradient changes in flexibility. It is expected to become a "leading technology" i
[Medical Electronics]
The advent of a new high-throughput combination 3D printing method may change the
Huawei executives respond to Qualcomm's lifting of the ban on 4G chips: We will continue to plan for next year's mobile phones
      Previous media reports said that Qualcomm has resumed supplying chips to Huawei, but currently only 4G, and 5G chips have not yet been approved.   Regarding such rumors, Zhang Pingan, president of Huawei Consumer Business Cloud Service, said in an interview with China News Service, "We saw the news report saying
[Mobile phone portable]
Qualcomm's chip business in the automotive industry
I have seen a lot of things about automotive chips recently, and I think it is necessary to sort out several American core chip manufacturers, starting with Qualcomm.   Qualcomm's revenue in fiscal year 2021 was $33.6 billion, a year-on-year increase of 43%, and its net profit was $9 billion, a year-on-year increase o
[Automotive Electronics]
Qualcomm's chip business in the automotive industry
Keysight Technologies and Qualcomm Technologies Collaborate to Demonstrate 5G New Radio Dual Connectivity for Ultra-High UL Data Throughput Speeds
According to foreign media reports, Keysight Technologies announced that it has collaborated with Qualcomm Technologies to achieve uplink (UL) data throughput speeds of 3.5 Gbps per second using 5G New Radio Dual Connectivity (NR-DC) with millimeter wave carrier aggregation (CA). Keysight Technologies is a leading tec
[Automotive Electronics]
Keysight Technologies and Qualcomm Technologies Collaborate to Demonstrate 5G New Radio Dual Connectivity for Ultra-High UL Data Throughput Speeds
iQOO Z6 Pro is under development and may be equipped with Qualcomm Snapdragon 778G
Last month, iQOO launched the iQOO Z6 smartphone in India with a Snapdragon 695 SoC and a 6.58-inch FHD+ LCD screen. Now, a new report has surfaced suggesting that the company is working on the iQOO Z6 Pro. According to 91Mobiles, industry sources pointed out that iQOO Z6 Pro is currently under development and is ex
[Mobile phone portable]
Latest Internet of Things Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号