Wu Hanming, academician of the Chinese Academy of Engineering: my country's opportunities in chip manufacturing
Latest update time：2021-09-04 20:40
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Semiconductor Industry Observer: On January 16, 2021, the annual high-level event for face-to-face in-depth exchanges between CEOs of Chinese chip companies and partners of top investment institutions, the
China IC Conference,
was grandly held in Shanghai. The second China IC Conference was hosted by Moore Elite and co-organized by Yunxiu Capital and Xinmou Research. At the conference, Wu Hanming, an academician of the Chinese Academy of Engineering and dean of the School of Micro-Nano Electronics at Zhejiang University, delivered a speech entitled "Thoughts on China's Integrated Circuit Chip Manufacturing".
Wu Hanming, academician of the Chinese Academy of Engineering and dean of the School of Micro-Nano Electronics at Zhejiang University
At the meeting, Academician Wu pointed out that the current situation is a good time to develop the semiconductor industry. In the past three months, cities such as Hefei and Shanghai have placed integrated circuits at the top of their development agenda during development proposal seminars.
Academician Wu introduced that from the process flow, the manufacturing of integrated circuits has three stages. In the first stage, sand is extracted and turned into a single wafer through high temperature; in the second stage, thousands of designed transistors are placed on silicon, which is the front-end process of chip manufacturing, which is the core of the entire chip manufacturing. The third stage is the back-end packaging, etc. Among these three stages, the first stage has a very low cost, about 1% of the relative cost, and the second stage accounts for 80%. And packaging accounts for about 19%. Academician Wu said that the development and investment intensity of the front-end process can be seen from the funding investment.
From the perspective of the ecological chain, integrated circuits are divided into four parts: materials, design, manufacturing and equipment. Academician Wu pointed out that among the four parts, my country's materials and equipment are still at a relatively weak stage. In terms of manufacturing, SMIC, as a leading enterprise in my country, has played a certain role in the development of domestic technology. Academician Wu further said that in terms of chip manufacturing, lithography machines are the most difficult part, but the development of technology cannot rely solely on lithography machines, and there are many comprehensive factors.
From the perspective of the development of chip technology, in the past 20 years, among the seven technologies that have been successfully crossed, each generation has a series of core technologies that need to be broken through. They can be summarized into three bottlenecks: the first type of material bottleneck, the second type of device architecture change, and the third type of photolithography limit technology breakthrough. These breakthroughs have enabled Moore's Law to develop smoothly in the past 20 years, and many of these key breakthroughs have been achieved through basic research, so basic research is very important for supporting the industry.
Where are the opportunities for my country? Academician Wu pointed out that the global situation is changing very fast at present, which can be said to be a major change that has not been seen in a century.
First of all, a single advanced R&D process will become increasingly difficult, so we must have some special processes, including new architectures and so on.
Secondly, under the current international security situation which is unpredictable, it is far more meaningful for my country to produce 55-nanometer products with basically independent and controllable equipment than to use all imported equipment to make products.
Furthermore, Moore's Law is slowing down, and the annual performance improvement of chips has reached saturation. This also gives followers an opportunity, as they are no longer developing as fast as before.
Looking at last year's sales data, last year, the share of production capacity at various technology nodes in global chip manufacturing was only 17% for advanced production capacity below the 10nm technology node, while 83% of the market share was at nodes above 10nm. There are still huge market and innovation spaces for relatively mature special processes, and there are many opportunities, which is an opportunity for China's chip manufacturing industry.
Academician Wu emphasized that there are also some things to pay attention to when doing technology research and development:
First of all, technological research and development must be led by the industry. We must never make our company a research-oriented company. It is a big misunderstanding to have only new technologies but no industrial support.
Secondly, we can explore a way to build a new engineering discipline of integrated circuits, a new system of introduction, assessment, and promotion, a complete system with the characteristics of industry-education integration, open up new ways to cultivate talents, and give play to international methods that are different from traditional engineering colleges.
In addition, the domestic industrial chain should have support to provide a complete set of process verification for upstream and downstream companies (materials, equipment, chip design, special process chips).
*Disclaimer: This article is originally written by the author. The content of the article is the author's personal opinion. Semiconductor Industry Observer reprints it only to convey a different point of view. It does not mean that Semiconductor Industry Observer agrees or supports this point of view. If you have any objections, please contact Semiconductor Industry Observer.
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