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PCB Design Collection

PCB design is one of the necessary design skills for every electronic engineer and is an important part of electronic product design. This article collection lists some basic knowledge of PCB design, matters that engineers need to pay attention to, and some experience sharing. Because there is too much information in this area, it is impossible to list them one by one. You can search in the download center by yourself.

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PCB design information Document List

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\"PCB Design Experience\" Full Version: Points it Requires : 1 Type:Application DocumentsUploader:常见泽1Date:2013-03-16; Introduction:The full version of \"PCB Design Experience\" introduces many valuable PCB design experiences, including appreciation cases of single and double-sided boards, wiring experience, layout experience, etc.

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PCB wiring design experience: Points it Requires : 1 Type:Application DocumentsUploader:常见泽1Date:2013-03-18; Introduction:PCB wiring design experience, including 6 PCB design documents

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Basic skills that PCB design engineers must have (many experience articles - very powerful): Points it Requires : 1 Type:Technical DocumentationUploader:sdyg_wjrDate:2014-03-14; Introduction:Basic skills that PCB design engineers must have (many experience articles - very powerful) The files include: \"Partition Design of Mixed Signal PCB\", \"PCB Design Experience\", \"Reliability Design of Printed Circuit Boards\", \"PCB Amateur Production Methods and Process Flow\", \"High-quality PCB Design\", etc.

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Electromagnetic compatibility and printed circuit boards - theory, design and wiring.pdf: Points it Requires : 1 Type:Technical DocumentationUploader:幸福的娃Date:2013-06-13; Introduction:Electromagnetic Compatibility and Printed Circuit Boards - Theory, Design and Wiring.pdf \"Electromagnetic Compatibility and Printed Circuit Boards\" analyzes and studies the issues involved in electromagnetic compatibility (EMC) and printed circuit boards (PCBs) from the perspectives of theory, design and wiring. The book contains 9 chapters. Chapters 1 to 3 introduce the basic principles of EMC, EMC in PCBs, and EMC in component design. Chapter 4 discusses the principles and characteristics of mirror planes in PCBs. Chapters 5 and 6 elaborate on bypass and decoupling in PCBs and the design principles of transmission lines. Chapters 7 to 9 discuss signal integrity and crosstalk, PCB trace terminals, and grounding principles in PCB wiring.

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An excellent PCB EMC design guide Get EMC Right First Time: Points it Requires : 1 Type:PaperUploader:solarelecDate:2019-02-27; Introduction:An excellent PCB EMC design guide Get EMC Right First Time

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HD Bookmark Full Chinese Version: Points it Requires : 2 Type:Technical DocumentationUploader:rain_noiseDate:2018-01-19; Introduction:Content Introduction: \"EMC Electromagnetic Compatibility Design and Test Case Analysis (2nd Edition)\" takes EMC case analysis as the main line, introduces EMC technology in product design through case description and analysis, and introduces readers to practical design and diagnosis techniques related to EMC in the product design process, so as to reduce the misunderstandings of designers in product design and EMC problem diagnosis. The EMC cases described in the book involve various aspects such as structure, shielding and grounding, filtering and suppression, cables, wiring, connectors and interface circuits, bypass, decoupling and energy storage, PCBLayout, as well as devices, software and frequency jitter technology.

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PCB current and signal integrity design: Points it Requires : 1 Type:Technical DocumentationUploader:高进Date:2018-01-12; Introduction:PCB Current and Signal Integrity Design Publisher: Machinery Industry Press Starting from the basic concepts of electronics, this book comprehensively explains the nature and flow of current on PCBs, discusses in detail the special problems in modern PCB design, proposes design solutions, discusses the signal integrity problems caused by current, and also proposes solutions to the complex challenges of very high frequency harmonics and very short wavelengths. The writing of this book integrates theory and engineering practice, minimizes tedious mathematical arguments, and is intuitive and vivid. This book is suitable for PCB engineers to read, and can also be used as a reference textbook for graduate students and senior undergraduates in related majors.

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PCB design information is a rare entry-level information for beginners (including factory production process): Points it Requires : 1 Type:Application DocumentsUploader:论文帝Date:2013-07-01; Introduction:PCB design materials, rare introductory materials for beginners (including factory production process). File list: Review and Prospect of my country\'s Electronic Information Products Import and Export Situation in 2000-2001.mht How to use Allegro to generate data from AutoCAD.mht Notes on Allegro to Gerber.pdf ALL high-speed PCB design technology Chinese materials.pdf BGA solder ball reset process.pdf New trend of CAD-CAM data conversion.mht Introduction to CAM-CAD process.mht CAM training manual.pdf ... and so on, all of which are reference materials suitable for PCB beginners.

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PCB related process encyclopedia 275 articles 65M: Points it Requires : 1 Type:Application DocumentsUploader:tywDate:2013-12-09; Introduction:PCB related process encyclopedia 275 articles 65M

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Multilayer PCB Design - Suitable for Beginners: Points it Requires : 1 Type:Application DocumentsUploader:justyouandmehrDate:2013-11-06; Introduction: Before designing a multi-layer PCB, the designer must first determine the circuit board structure to be used based on the scale of the circuit, the size of the circuit board, and the requirements of electromagnetic compatibility (EMC), that is, whether to use a 4-layer, 6-layer, or more-layer circuit board. After determining the number of layers, the placement of the inner electrical layer and how to distribute different signals on these layers are determined. This is the issue of selecting the stacking structure of a multi-layer PCB. The stacking structure is an important factor affecting the EMC performance of the PCB board, and it is also an important means of suppressing electromagnetic interference. This section will introduce the relevant content of the stacking structure of a multi-layer PCB board.

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High-layer board production and process control: Points it Requires : 1 Type:Application DocumentsUploader:华强PCB厂家Date:2015-08-27; Introduction:High-layer board production and process control

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Common component package library Document List

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Commonly used PADS package libraries: Points it Requires : 1 Type:ToolsUploader:9988Date:2019-04-09; Introduction:PADS common component library and package download

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PCB design experience: Altium+designer+component library (final version): Points it Requires : 1 Type:PaperUploader:mamselcDate:2018-09-03; Introduction:PCB design experience: Altium+designer+component library (final version)

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Electronic component packaging library production standards: Points it Requires : 1 Type:Application DocumentsUploader:qwqwqw2088Date:2015-02-04; Introduction:Component Zero Orientations for CAD Libraries

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TI component library (component library, package library, 3D library): Points it Requires : 2 Type:Circuit LibraryUploader:qwqwqw2088Date:2019-01-07; Introduction:I have organized the complete series of TI (Texus Instrument) component libraries, including schematic symbols, PCB packages and simple 3D models. Although it is not the latest, it covers almost all TI product categories, including: Amplifier Audio Clock & Timing Data Converters Interface (RS485, RS232, Ethernet, USB, etc.) Isolation Logic (Logic, such as 74 series) Microcontrollers Motor Drivers Power Management Switches There are too many products to list PN one by one, so you can download it and check it yourself

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Chip Aluminum Electrolytic Capacitor Package Library: Points it Requires : 1 Type:Circuit LibraryUploader:hubj627Date:2015-04-23; Introduction:Aluminum electrolytic capacitor package library. Also includes a commonly used component library that I have accumulated personally.

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Commonly used AD component library and package library: Points it Requires : 1 Type:Circuit LibraryUploader:ty467278Date:2019-03-29; Introduction:Commonly used AD component library and package library

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AD10 component library is quite complete: Points it Requires : 1 Type:Circuit LibraryUploader:cronaldo7thDate:2014-04-16; Introduction:This component library is a long-term collection of component libraries and package libraries, including: Atmel library, AMP library, analog library and some other self-established libraries, supporting but not limited to AD10 version.

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AD Standard Package Library: Points it Requires : 1 Type:Circuit LibraryUploader:sigmaDate:2018-08-13; Introduction:AD package libraryAD package libraryAD package library

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3D Connector Footprint Library: Points it Requires : 1 Type:Circuit LibraryUploader:sigmaDate:2018-08-13; Introduction:3D Connector Footprint Library3D Connector Footprint Library

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PCB package library_99SE and DXP: Points it Requires : 1 Type:Application DocumentsUploader:lamasDate:2014-03-05; Introduction:The PCB package library includes the package libraries of two drawing tools, 99SE and DXP/AD. It is the result of many years of accumulation by engineers and covers almost most of the commonly used device packages.

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PCB Design Tool Resources Document List

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Cadence System-Level Package Design Guide (Book): Points it Requires : 2 Type:Technical DocumentationUploader:碧海秋风Date:2020-03-25; Introduction:System-level packaging is one of the current packaging technology trends. This book systematically introduces the packaging process of Cadence software SIP software, using examples to explain it, which is easy to understand.

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Contents of the CD-ROM accompanying Altium Designer Schematic and PCB Design and Simulation: Points it Requires : 1 Type:Technical DocumentationUploader:TimsonDate:2013-10-09; Introduction:This document is the content of the CD-ROM of \"Altium Designer Schematic and PCB Design and Simulation\" Title: \"Altium Designer Schematic and PCB Design and Simulation\" Author: Xie Longhan, Lu Li, Zhang Guidong Publication Date: 2012-01 Introduction: Starting from the perspective of beginners, this book systematically introduces the various functions of Altium Designer 10.0 and the usage skills to improve drawing efficiency with a new perspective and reasonable layout, and introduces the PCB design process in detail with specific examples. This book has 11 chapters, and the whole book introduces the entry operation of Altium Designer 10.0, schematic development environment, drawing circuit schematics, advanced schematic design, PCB design environment, drawing PCB, advanced PCB design, component library operation, simulation, etc. In addition to the operation examples of each chapter, the CD-ROM that comes with the book also has two engineering examples carefully selected for readers, \"Network Communication Module Design\" and \"MP3 Player Circuit Design\". Both examples have passed actual experimental verification, and actual product production can be completed on this basis. The book is systematic, practical and professional, and the CD also includes video demonstrations and explanations of the operation.

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CADENCE High-Speed Circuit Board Design and Simulation (Schematic and PCB Design - 4th Edition): Points it Requires : 1 Type:Application DocumentsUploader:TimsonDate:2013-09-28; Introduction:CADENCE High-Speed Circuit Board Design and Simulation (Schematic and PCB Design - 4th Edition)

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Altium Designer Practical Guide and High-Speed PCB Design Edited by Huang Jieyong and Lin Chaowen: Points it Requires : 1 Type:CourseUploader:唯梦想不可负Date:2018-12-24; Introduction:Altium Designer Practical Strategy and High-speed PCB Design, edited by Huang Jieyong and Lin Chaowen, P308, 2015.07

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AD9 Circuit Design Case Tutorial (30 Lectures): Points it Requires : 1 Type:CourseUploader:tiankai001Date:2013-05-02; Introduction:AD9 Circuit Design Case Tutorial (30 Lectures)

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PADS9.5 practical strategy and high-speed PCB design: Points it Requires : 1 Type:PaperUploader:csdn_canDate:2019-02-27; Introduction:PADS9.5 practical strategy and high-speed PCB design

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PCB Layout Graphic Tutorial Final Edition (Altium, Cadence, PADS): Points it Requires : 1 Type:CourseUploader:tiankai001Date:2013-03-30; Introduction:PCB Layout Graphic Tutorial Final Edition (Altium, Cadence, PADS)

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Altium Designer multilayer board production method: Points it Requires : 2 Type:Application DocumentsUploader:大爱无疆Date:2014-11-12; Introduction:Very good discussion on how to create multiple layers in Altium Designer. I hope it will be helpful to everyone.

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PCB project file sharing Document List

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Protel DXP 2004 SP2 Schematic and PCB Design (2nd Edition): Points it Requires : 3 Type:Technical DocumentationUploader:yuwei664Date:2013-09-02; Introduction:Protel DXP 2004 SP2 Schematic and PCB Design (2nd Edition) \"Protel DXP 2004 SP2 Schematic and PCB Design (2nd Edition)\" is the most popular electronic circuit computer-aided design software, which has been widely used in various fields such as electrical engineering, electronics, and automatic control. Its powerful design functions and brand-new system structure are deeply loved by the majority of electronic design workers. \"Protel DXP 2004 SP2 Schematic and PCB Design (2nd Edition)\" is based on ProtelDXP2004SP2, combined with a large number of specific examples, and elaborates on the schematic and PCB design technology in detail. According to the schematic and PCB design process, the book introduces the basic operation of schematic and PCB design, editing environment settings, component package generation, PCB generation and layout and wiring, generation of various reports, circuit simulation and signal integrity analysis methods and techniques, as well as the method of using ProtelDXP2004 for VHDL language and FPGA design. The content of each chapter is narrated with examples as the center, combined with the author\'s accumulated practical experience in actual design, and summarizes many precautions in practical applications. To facilitate readers\' learning, \"Protel DXP 2004 SP2 Schematic and PCB Design (2nd Edition)\" has a corresponding number of various exercises at the end of each chapter, which can be used to consolidate theoretical knowledge and computer operation. \"Protel DXP 2004 SP2 Schematic and PCB Design (2nd Edition)\" explains in simple terms, starting with the easy and then the difficult, step by step, with examples throughout the book.

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Cortex-M3 STM32F103 Development Board Protel PCB Schematic: Points it Requires : 2 Type:CourseUploader:bootloaderDate:2013-06-26; Introduction:STM32F103 development board, including schematics and PCB diagrams in Protel format, which can be used directly for board development.

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Protel 99 PCB package library and schematic diagram of C8051F series microcontroller: Points it Requires : 1 Type:Application DocumentsUploader:baidu_linkerDate:2014-03-05; Introduction:Protel 99 PCB package library and schematic diagram of C8051F series microcontrollers.

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Six-layer DSP ARM schematics, PCB: Points it Requires : 1 Type:Circuit LibraryUploader:okhxyyoDate:2016-03-02; Introduction:The file contains: six-layer DSP ARM schematic and PCB

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Classic 51 single-chip computer minimum system schematic diagram and PCB: Points it Requires : 1 Type:Source CodeUploader:fqsfyqDate:2015-07-15; Introduction:It contains the schematic diagram and PCB of the 51 smallest single-chip microcomputer, as well as the schematic diagram library of the 51 single-chip microcomputer.

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(Collection) 51 MCU development board schematic application example, PCB diagram: Points it Requires : 1 Type:Circuit LibraryUploader:lamabaDate:2014-03-05; Introduction:(Collection) 51 single-chip microcomputer development board schematic application examples, PCB diagram, including all the functions of the development board purchased on the market, and also includes a list of components, rare and good information!

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200 electronic production Altium Designer schematics and PCB diagrams: Points it Requires : 2 Type:Circuit LibraryUploader:shijizaiDate:2018-07-29; Introduction:200 electronic production Altium Designer schematics and PCB diagrams

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PCBA Information Document List

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Huawei PCBA Inspection Specifications.pdf: Points it Requires : 1 Type:Application DocumentsUploader:baidu_linkerDate:2019-05-29; Introduction:Huawei PCBA Inspection Specifications

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PCBA_Design for Manufacturing (DFM) Specifications: Points it Requires : 2 Type:Application DocumentsUploader:king元Date:2014-11-26; Introduction:PCBA_Design for Manufacturing (DFM) Specifications

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PCBA Production Notes: Points it Requires : 1 Type:Application DocumentsUploader:csdn_canDate:2013-09-29; Introduction: PCBA Production NotesPCBA Production NotesACTIONS QA Hilxie Email:hilxie@actions.com.cnActions confidential and proprietary2005-5-12 1 Outline1. Summary2. IC packaging and storage3. ESD and EOS protection measures in the process4. SMT assembly and PCBA test requirements5. REWORK notes6. IC shape and important size specifications7. Return processing and replacement of good products2005-5-12 2 SummaryDue to the increasingly thin and fine line width of IC shape, IC is vulnerable to EOS and ESD damage, resulting in permanent failure. Analysis shows that the defects caused by EOS and ESD account for the top three. Although necessary measures are taken in the design to ensure the reliability of IC, the damage caused by EOS and ESD to IC cannot be effectively eliminated. It is also necessary to control the production process to avoid EOS and ESD destructive damage to IC. At the same time, due to the storage and use of IC that do not meet the requirements, it often leads to \"popcorn\" and \"delamination\" phenomena in the SMT processing process, which is also an important reason for damaging IC. Here we discuss how to avoid IC damage during PCBA manufacturing and promote the improvement of production quality. 2005-5-12 3 IC packaging and storage Plastic-sealed large-scale integrated circuits have hygroscopic surfaces. If the IC is exposed to the air for a long time, it will absorb moisture in the air, which will cause the so-called \"popcorn\" phenomenon during the SMT process, causing the IC to fail. Therefore, the IC must be baked before packaging or use. The IC is baked at 125 degrees Celsius for 7 hours before leaving the factory at ACTIONS, and then vacuum-packed to ensure that it can be stored for 12 months at 40 degrees Celsius and relative humidity below 90%. If the IC is in this environment, the customer can perform the SMT welding procedure within 72 hours after unpacking (environmental requirements: 30 degrees Celsius and relative humidity below 60%), otherwise the IC must be re-baked. 2005-5-12 4 If the IC is not used up within 72 hours, it must be baked to remove the IC moisture absorption problem. Baking conditions: at 125...

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PCBA Inspection Standards: Points it Requires : 1 Type:Application DocumentsUploader:crazyjacksonDate:2013-09-29; Introduction: PCBA inspection standards, PCBA inspection specifications...

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PCBA inspection specifications: Points it Requires : 1 Type:Application DocumentsUploader:lamasDate:2013-09-22; Introduction:1. Purpose: To establish the PCBA appearance inspection standard to provide guidance for the production process and product quality assurance. 2. Scope: 2.1 This standard is applicable to the appearance inspection of any PCBA produced by our company (except for special provisions). It includes products produced in-house and outsourced. 2.2 Special provisions refer to: Due to the characteristics of the parts or other special requirements, the PCBA standard can be appropriately revised, and its effectiveness should exceed the general appearance standard. 3. Definition: 3.1 Standard [Accept Criterion]: The acceptance criteria include three conditions: ideal condition, acceptable condition, and rejection condition. [Target Condition]: This assembly condition is close to the ideal and perfect assembly result. It can have good assembly reliability and is judged as the ideal condition. [Accept Condition]: This assembly condition does not meet the ideal condition, but it can maintain assembly reliability, so it is considered a qualified condition and is judged as an acceptable condition. 【Reject Condition】: This assembly condition fails to meet the standard and may affect the functionality of the product, but it is determined as a reject condition based on appearance factors to maintain the competitiveness of our company\'s products. 3.2 Definition of Defects 【Critical Defect】: A defect that is sufficient to cause harm to the human body or machine, or endanger the safety of life and property, is called a critical defect, and is represented by CR. 【Major Defect】: A defect that has lost its practicality in the actual function of the product or caused a decrease in reliability, and the product is damaged or malfunctioning is called a major defect, and is represented by MA. 【Minor Defect】: It refers to the performance of the unit defect, which does not actually reduce its practicality and can still achieve the desired purpose. It is generally a difference in appearance or mechanical assembly, and is represented by MI. 3.3 Explanation and definition of solderability terms: 【Wetting】: It is the solder that is coated on the surface of the object to be soldered. The smaller the wetting angle, the better the solderability. 【Wetting Angle】 The angle enclosed by the contact wires between the surface of the object being soldered and the molten solder (such as accessories). It is generally the interface between the liquid surface and other objects being soldered or liquids. The smaller this angle is, the better the solderability. 【Non-Wetting】 The surface of the object being soldered cannot be well attached to the solder. At this time, the wetting angle is greater than 90 degrees. 【De-Wetting】 The solder that was originally tinned shrinks. Sometimes a very thin solder film remains. As the solder shrinks, the wetting angle increases. 【Solderability】 The surface characteristics of molten solder adhering to the object being soldered. 4. Reference Document Reference IPC-A-610B International Standard for Board Assembly 5. Responsibilities: 6. Work Procedure and Requirements Procedure and Requirements 6.1 Preparation of Inspection Environment 6.1.1 Lighting: Indoor lighting is above 800LUX, and if necessary, it is inspected and confirmed with (three times or more) (inclusive) magnifying lights; 6.1.2 ESD protection: Anyone who touches PCBA must wear good electrostatic protection measures (wear clean gloves and anti-static wristbands connected to the electrostatic grounding wire); 6.1.3 Before inspection, it is necessary to confirm that the working platform used is clean. 6.2 If this standard conflicts with other standard documents, the order is as follows: 6.2.1 Special requirements proposed by the engineering documents, assembly work instructions, rework work instructions, etc. provided by our company; 6.2.2 This standard; 6.2.3 The latest version of IPC-A-610B specification Class 1 6.3 For items not listed in this specification, the latest version of IPC-A-610B specification Class 1 shall be used as the standard. 6.4 If there is a dispute over the appearance standard, the Quality Management Department shall interpret and determine whether it is acceptable. 6.6 If there is a functional problem, the Engineering, Development or Quality Management Department shall analyze the cause and the responsible unit, and after repair, the Quality Management Department shall re-determine whether the appearance is acceptable.

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