\"Introduction to Microsystem Packaging Technology\" focuses on microelectronics packaging and integration technology, integrating MEMS packaging technology, RF system packaging technology, optoelectronic packaging technology, and introduces the basic technology of microsystem packaging design, thick film fine processing technology, substrate technology and interconnection technology, component-level packaging integration technology, module assembly and system-level packaging technology. \"Introduction to Microsystem Packaging Technology\" can be used as a textbook for microelectronics, optoelectronics, MEMS and other majors, and can also be used as a reference book for practitioners in the field of information technology to understand the basic knowledge of microsystem technology and the latest development technology.
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