\"Embedded System Reliability Design Technology and Case Analysis\" Author: Wu Yeqing, published in July 2017. \"Embedded System Reliability Design Technology and Case Analysis\" introduces which parts of embedded system design are most likely to bring reliability risks, and how to prevent them from the design. The content includes: basic knowledge and methods of reliability such as the difference in stress state during the startup process and steady-state operation; selection methods of derating parameters and derating factors; quantitative calculation selection and testing methods of fans and heat sinks, thermal design specifications of structures and circuits; PCB board wiring layout, electromagnetic compatibility measures of system structure; failure factors (including EOS, ESD, MSD, etc.) and prevention and inspection methods in the manufacturing process of electronic products; technical content in maintainability design specifications, availability design specifications, safety design specifications, interface software reliability design specifications, etc. At the same time, actual case analysis is carried out for related content to enable readers to better master these knowledge.
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