As electronic products become more and more powerful, the requirements for portability are also getting higher and higher. Miniaturization design has become a research topic for many electronic design companies. This article takes the methods, challenges and trends of miniaturization design as the main line, and combines the powerful functions of Cadence SPB16.5 in miniaturization design to comprehensively analyze the engineering implementation of miniaturization design. It mainly includes the following contents: the current status and trends of miniaturization design, as well as the current mainstream HDI processing technology, the introduction of the latest ANYLAYER (arbitrary layer) technology design method and process implementation, the introduction of the application of buried resistors and buried capacitors, the design method and process implementation of embedded components. At the same time, the support of Cadence SPB16.5 software for miniaturization design is introduced. Finally, the application and simulation method of HDI design in high speed, the application of HDI in communication system products, and the comparison between HDI and back drilling are introduced.
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