This research project is aimed at the high-density packaging requirements of IC chips for portable electronic products such as mobile phones and MP4s. It adopts the latest national invention patent \"bare chip building block packaging method\", which will embed the integrated circuit bare chips on the same printed circuit board into the PCB like building blocks, and use semiconductor photolithography technology to directly interconnect the chips and the chips and PCB to complete the manufacturing process of the electronic whole machine board. This method can reduce the volume of the electronic whole machine chip template by 5 to 20 times. This article provides a detailed introduction to the research content, technical innovations, process implementation plan and typical applications of this patent invention.
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