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ESD Suppression Guidelines for PCB Design

2013-09-20
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ESD suppression guidelines for PCB design: PCB layout is a key element of ESD protection. Reasonable PCB design can reduce unnecessary costs caused by fault inspection and rework. In PCB design, since transient voltage suppressor (TVS) diodes are used to suppress direct charge injection caused by ESD discharge, it is more important to overcome the electromagnetic interference (EMI) electromagnetic field effect generated by the discharge current. This article will provide PCB design guidelines that can optimize ESD protection. Circuit loop Current enters the circuit loop through induction. These loops are closed and have changing magnetic flux. The amplitude of the current is proportional to the area of the loop. Larger loops contain more magnetic flux, thus inducing stronger current in the circuit. Therefore, the loop area must be reduced. The most common loop is shown in Figure 1, which is formed by power and ground wires. When possible, a multi-layer PCB design with power and ground layers can be used. Multi-layer circuit boards not only minimize the loop area between power and ground, but also reduce the high-frequency EMI electromagnetic field generated by ESD pulses.

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