The residual stress caused by packaging is a key issue in the packaging and assembly of electronic devices. Using silicon piezoresistive sensors, the stress changes on the chip surface and the distribution of residual stress during the curing process of different adhesives on 1.@ organic laminate substrates were recorded in situ and in real time. Studies have shown that when using organic adhesives with a smaller thermal expansion coefficient to bond chips, lower residual stress and relatively superior stress distribution can be obtained. This method can be used as a reference for selecting organic adhesives when directly bonding chips. Keywords< Silicon piezoresistive stress sensor E Adhesive E Residual stress
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