Thermal design of a solid-state transmitter ViPu information http://www.cqvip.com 2001 No.3 ( . Lane No.76) M 6 o de r n El e ct r. n e e s N o. 3 20 01 ( S e r i es N o. 76) Thermal design of a solid-state transmitter Ther ma l De s i g n o f a So l i d ― S t a t e Tr a n s mi t e r LIU Yong-zhi (East China Institute of Electronic Engineering, Taiwan 230031 ) 【Abstract】 The thermal design of a solid-state transmitter is discussed. A special study was conducted on the heat dissipation of heat sources in the table and high power density power amplifier components. The thermal design analysis and calculation of the board and system group were completed, and a prototype test study was carried out. The equal headwind of the forced air-conditioning ventilation cooling system was realized and good results were achieved. Keywords Thermal design Power amplifier components Transmitter Abstract:The the her m a[de s i g n o f a s ol i d― s t a t e t r a ns mi t t er i s p r e n t e d i n t his pape r . t he a t d i s i p a t i o n o f i n t e g r a t e d h e a t N o l r e e a n d p o we r a mp l i f i e r a s s e mb ……
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