1. Introduction to the principles of pressure sensing components Among all components manufactured by micro-machining technology, pressure sensing components are the earliest to be commercialized and are also the most widely used. Pressure sensing components have been widely used in automobiles, medical treatment, industrial measurement, automatic control and various electronic products. There are many principles used in pressure sensing components, such as piezoelectric effect, piezoresistive effect, and capacitive effect. Piezoelectric effect The so-called piezoelectric effect refers to the electrical effect that a material can produce when a mechanical force acts on the material. Conversely, when an electric field is applied to the material, the material can produce mechanical deformation. This phenomenon only exists in certain crystalline materials, such as quartz, zinc oxide (ZnO), barium titanate ceramics (BaTiO3), lead zirconium titanate ceramics (PbZrTiO3, PTZ), or some special chemical polymers such as PVDF. Since silicon crystals have a centrally symmetrical grid structure and cannot exhibit their piezoelectric properties, these materials must be coated on the surface of silicon crystals through a certain process to have piezoelectric properties. For example, quartz must be cut along a certain axis, and piezoelectric ceramics must undergo high electric field polarization. Piezoresistive effect The so-called piezoresistive effect refers to a phenomenon in which the resistance value of a material changes when a material is subjected to stress. This phenomenon is common in various materials, and the effect is particularly significant in some semiconductors. At present, the most commonly used method for manufacturing silicon pressure sensing components is to use diffusion or ion implantation to dope boron into the single crystal silicon lattice to form a pn junction. This pn junction is a piezoresistive component that can be used to sense pressure changes on the silicon crystal diaphragm. The resistors for sensing pressure are connected in a Wheatstone bridge manner, as shown in FIG. 1 , wherein the resistor R1 is a silicon pressure sensing component.
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