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WiFi Module production flow

  • 2013-09-29
  • 920.83KB
  • Points it Requires : 2

              WiFi Module production flowWiFi Module Production FlowSiP (System in Package Technology) It is the alternative of the SOC(System on Chip)  It is much more than a package concept  Functional system or subsystem into one package  An advanced packaging technology of module Product  Multi-Process of the components assembly on substrate  Chip level interconnected technology (Flip chip, Chip stacking, Multi-Chip, Wire bonding)  Quite often includes passive components (SMD, Embedded R / L / C)Download F/W Tx/Rx Test Throughput Test MAC/DomainSurface Mounting 0201 Chip Component Capability  CSP and Flip Chip Bonding  Lead Free Soldering  N2 Atmosphere Soldering Reflow  CFC Free Solvent CleanSingulation Saw Cutting  SnappingTesting Device type:WLAN Module/Device(802.11a/g/b) , Power Amplifier/RF FEM, F……             

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